CYT2B75CADQ0AZSGS

CYT2B75CADQ0AZSGS


  • Manufacturer: Infineon Technologies
  • CONEVO NO: CYT2B75CADQ0AZSGS
  • Package: 100-LQFP
  • Datasheet: PDF
  • Stock: In stock
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Parameters
Series Traveo™ II T2G
RoHS Status ROHS3 Compliant
Package / Case 100-LQFP
Mfr Infineon Technologies
Mounting Type Surface Mount
Operating Temperature -40°C ~ 105°C (TA)
Supplier Device Package 100-LQFP (14x14)
Speed 100MHz, 160MHz
Oscillator Type External, Internal
Core Processor ARM® Cortex®-M0+, ARM® Cortex®-M4F
RAM Size 128K x 8
Number of I/O 78
Peripherals Brown-out Detect/Reset, Crypto - AES, DMA, LVD, POR, PWM, SHA, TRNG, WDT
Voltage - Supply (Vcc/Vdd) 2.7V ~ 5.5V
EEPROM Size 96K x 8
Program Memory Type FLASH
Connectivity CANbus, FIFO, I²C, IrDA, LINbus, SPI, UART/USART
Core Size 32-Bit Dual-Core
Program Memory Size 1.0625MB (1.0625M x 8)
Data Converters A/D 57x12b SAR
Package Tray
Product Status Active
Standard Package 900

CYT2B75CADQ0AZSGS Infineon TRAVEO™ T2G Dual-Core Automotive 32-bit MCU

CYT2B75CADQ0AZSGS belongs to Infineon TRAVEO™ T2G CYT2B7 automotive-grade MCU series, housed in standard 100-pin LQFP(14×14mm) tray packaging compliant with RoHS3 and AEC-Q100 industrial automotive specifications, built around dual 32-bit ARM Cortex-M4F(160MHz main computing core) plus Cortex-M0+(dedicated security auxiliary core) architecture with 1.0625MB main Flash,96KB auxiliary work Flash,128KB internal SRAM and 96KB configurable EEPROM, supporting 2.7V~5.5V wide supply voltage and -40℃~+125℃ operating ambient temperature to satisfy rigorous automotive electronic thermal and power fluctuation working conditions.

CYT2B75CADQ0AZSGS Features and Applications

This automotive MCU integrates abundant high-performance on-chip peripherals including 57-channel 12-bit SAR ADC,multi-channel CAN FD/LIN/SPI/I2C/UART serial interfaces,rich TCPWM timer modules and embedded AES/SHA/TRNG hardware crypto engine for trusted data encryption,equipped multi-stage memory protection unit,multiple low-power operation modes(Active/Sleep/DeepSleep/Hibernate) and built-in POR/LVD/Watchdog monitoring circuit,adds full DMA resource allocation to reduce main core load and improve overall system operating efficiency while supporting ASIL-B functional safety certification requirements for reliable vehicle-grade circuit design.

It is widely deployed in automotive body control modules,car cabin HMI control panels,automotive lighting driver boards,new energy vehicle low-voltage auxiliary control units,industrial rugged automation controllers and smart sensor centralized processing boards,acting as mainstream cost-effective dual-core MCU solution for mid-range automotive body electronics and harsh-environment embedded intelligent control equipment.

Alternative MCUs

● CYT2B73CADQ0AZSGS(Infineon):Pin-compatible TRAVEO T2G in-house alternative with smaller Flash capacity and identical 100-LQFP footprint for direct PCB replacement during original part stock shortage.

● S32K148UAT0VLLT(NXP):NXP automotive dual-core MCU with matching AEC-Q100 grade,similar peripheral configuration and equivalent operating temperature range as cross-brand second-source substitution option.

● GD32A507RET6(GigaDevice):Domestic automotive-grade 32-bit MCU featuring comparable communication peripherals and wide voltage range for low-cost mass production substitution demands.

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