Infineon Technologies SLE66R16PMCC8IXHSA1

SLE66R16PMCC8IXHSA1


  • Manufacturer: Infineon Technologies
  • CONEVO NO: SLE66R16PMCC8IXHSA1
  • Package: Die
  • Datasheet: -
  • Stock: In stock
  • Description: SLE66R16PMCC8IXHSA1(Kg)

Details

Tags

Parameters
Mfr Infineon Technologies
Series my-d™ NFC
Package Tape & Reel (TR)
Product Status Discontinued at Digi-Key
Digi-Key Programmable Not Verified
Applications Security
Core Processor -
Program Memory Type -
Controller Series -
RAM Size -
Interface ISO14443-3 Type A, NFC Forum Type 2
Voltage - Supply -
Operating Temperature -25°C ~ 70°C
Mounting Type Surface Mount
Package / Case Die
Supplier Device Package Wafer
Base Product Number SLE 66
RoHS Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 1 (Unlimited)
REACH Status REACH Unaffected
HTSUS 0000.00.0000
Other Names SP000953280
Standard Package 59,000
Contact Information
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