Intel 10M04DAF256C8G

10M04DAF256C8G


  • Manufacturer: Intel
  • CONEVO NO: 10M04DAF256C8G
  • Package: 256-LBGA
  • Datasheet: PDF
  • Stock: In stock
  • Description: 10M04DAF256C8G(Kg)

Details

Tags

Parameters
Series MAX® 10
Moisture Sensitivity Level (MSL) 3 (168 Hours)
RoHS Status RoHS Compliant
Package / Case 256-LBGA
Mfr Intel
Mounting Type Surface Mount
Operating Temperature 0°C ~ 85°C (TJ)
Supplier Device Package 256-FBGA (17x17)
Number of I/O 178
Voltage - Supply 1.15V ~ 1.25V
Number of Logic Elements/Cells 4000
Number of LABs/CLBs 250
Total RAM Bits 193536
Package Tray
Product Status Active
Conevo-Key Programmable Not Verified
REACH Status REACH Unaffected
Standard Package 90
ECCN 3A991D
HTSUS 8542.39.0001

MAX® 10 Field Programmable Gate Array (FPGA) IC 178 193536 4000 256-LBGA


10M04DAF256C8G Description

Efficient integration and reduced IC space in 256 lbga package and surface mount. The 10M04DAF256C8G is a field programmable gate array (FPGA) for the MAX®10 series. The FPGA has 250 lab/CLBS and 4000 logic elements/units. To ensure efficient power use, the supply voltage is 1.15V to 1.25V. The IC also has 193,536 RAM bits and 178 I/ OS to meet a variety of peripheral device connectivity needs and ensure efficient data processing. The equipment shall operate within the applicable range of 0°C to 85°C (TJ).


Features

MAX® 10 Field Programmable Gate Array (FPGA) IC

178 I/O ports 193536 RAM Bits 4000 Logic Elements/Cells

256-LBGA Package


Applications

5G wireless

Data center

Wireless communication

AI intelligence

Automated industry

Medical science field


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