10M08SCU169I7G
| Parameters | |
|---|---|
| Series | MAX® 10 |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| RoHS Status | RoHS Compliant |
| Package / Case | 169-LFBGA |
| Mfr | Intel |
| Mounting Type | Surface Mount |
| Operating Temperature | -40°C ~ 100°C (TJ) |
| Supplier Device Package | 169-UBGA (11x11) |
| Number of I/O | 130 |
| Voltage - Supply | 2.85V ~ 3.465V |
| Number of Logic Elements/Cells | 8000 |
| Number of LABs/CLBs | 500 |
| Total RAM Bits | 387072 |
| Package | Tray |
| Product Status | Active |
| Conevo-Key Programmable | Not Verified |
| REACH Status | REACH Unaffected |
| Standard Package | 176 |
| ECCN | 3A991D |
| HTSUS | 8542.39.0001 |
10M08SCU169I7G non-volatile MAX 10 FPGA IC 130 387072 8000 169-LFBGA
The 10M08SCU169I7G from Intel/Altera is a non-volatile MAX® 10 FPGA that integrates 8,000 logic elements (LEs) and 387 Kbits of embedded RAM in a compact 169-ball UBGA package (11 mm x 11 mm). Built on a 55 nm embedded flash process, this device uniquely combines programmable logic with on-chip configuration flash and a 12-bit analog-to-digital converter (ADC), eliminating the need for an external configuration PROM and enabling true single-chip mixed-signal design. It operates from a 3.3 V core supply with 130 user I/O pins supporting LVDS, LVCMOS, and other standards, and is rated for the industrial temperature range (-40°C to +100°C TJ). This FPGA is designed for cost-sensitive embedded applications requiring instant-on capability, low static power, and moderate logic density.
10M08SCU169I7G FPGA Selection Advantages
The primary advantage of the 10M08SCU169I7G is its unprecedented level of integration for a low-cost FPGA. By eliminating the external configuration chip, it reduces total system cost, board space, and power-on latency. The inclusion of a hardened ADC is a distinct differentiator, allowing designers to replace discrete analog components and create more compact mixed-signal PCBs. Unlike SRAM-based FPGAs that are volatile and require a boot sequence, this device is non-volatile and immediately operational, which is essential for safety-critical control logic.
Alternative FPGA Models
1. 10M04SCU169I7G (Intel): A pin-compatible lower-density variant in the same package with 4,000 LEs, offering a cost-reduction path for designs that do not require the full 8K LE capacity.
2. 10M16SCU169I7G (Intel): A higher-density sibling with 16,000 LEs and more memory, providing a seamless upgrade path within the same MAX 10 family for more complex logic requirements.
3. LCMXO2-7000HC-4BG256C (Lattice): A competing low-power, non-volatile FPGA (MachXO2 series) with similar logic density but typically focused on ultra-low-power consumer and control applications.
4. XC6SLX9-2CSG225C (Xilinx): A SRAM-based Spartan-6 FPGA requiring an external flash, offering higher performance and more I/O but at a higher total system cost and larger footprint.
