5SGXEA7N2F40I3LN
| Parameters | |
|---|---|
| Series | Stratix® V GX |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| RoHS Status | RoHS Compliant |
| Package / Case | 1517-BBGA, FCBGA |
| Mfr | Intel |
| Mounting Type | Surface Mount |
| Operating Temperature | -40°C ~ 100°C (TJ) |
| Supplier Device Package | 1517-FBGA (40x40) |
| Number of I/O | 600 |
| Voltage - Supply | 0.82V ~ 0.88V |
| Number of Logic Elements/Cells | 622000 |
| Number of LABs/CLBs | 234720 |
| Total RAM Bits | 51200000 |
| Package | Tray |
| Product Status | Obsolete |
| Conevo-Key Programmable | Not Verified |
| Base Product Number | 5SGXEA7 |
| Other Names | 966458 |
| Standard Package | 21 |
| ECCN | 3A001A2C |
| HTSUS | 8542.39.0001 |
5SGXEA7N2F40I3LN Stratix V GX FPGA IC 600 51200000 622000 1517-BBGA, FCBGA
The 5SGXEA7N2F40I3LN is a high-performance Stratix V GX FPGA developed by Intel (formerly Altera), built on 28 nm process technology to deliver exceptional logic density, high-speed serial connectivity, and robust embedded processing capability for advanced networking, communications, and industrial systems. It integrates 622,000 logic elements (LEs), 234,720 adaptive logic modules (ALMs), and 57.16 Mb maximum embedded memory, alongside 256 DSP blocks for intensive arithmetic operations, enabling it to handle complex algorithms and large-scale data processing efficiently. Equipped with 48 high-speed transceivers supporting up to 14.1 Gb/s NRZ data rate and 600 user I/Os, it offers flexible high-bandwidth interfacing, while the 1517-ball FCBGA (40×40 mm) package ensures reliable integration in high-density designs. Operating from 0.82 V to 0.88 V core voltage across -40°C to +100°C junction temperature, it balances low power consumption with high performance for harsh industrial and high-reliability applications.
The 5SGXEA7N2F40I3LN is widely utilized in high-speed networking equipment such as core routers, switches, and optical communication systems, leveraging its high-speed transceivers and large logic capacity for data plane processing and protocol acceleration. It serves as a key component in wireless communication infrastructure, including 4G/5G base stations and remote radio heads, providing reliable signal processing and high-bandwidth data interfacing. It is ideal for industrial automation, medical imaging, and aerospace systems, where its robust fault tolerance, extended temperature range, and high computational power ensure consistent performance in harsh conditions. It also applies to high-performance computing (HPC) and video surveillance systems, enabling real-time data analysis, image processing, and scalable system expansion.
Alternative FPGAs
● Xilinx XC7VX690TFFG1927: High-end 28 nm Virtex-7 FPGA with 693,600 logic cells, 48 transceivers up to 13.1 Gb/s, and 1927-BBGA package, offering comparable high-speed performance for networking and HPC applications.
● Lattice Semiconductor ECP5-85F-1517C: Low-power 28 nm FPGA with 84K logic elements, 32 transceivers up to 10.3 Gb/s, and 1517-FBGA package, optimized for cost-sensitive high-volume communication designs.
● Microchip (Microsemi) PolarFire MPF300T-FCG1517: 28 nm low-power FPGA with 300K logic elements, 48 transceivers up to 12.5 Gb/s, and 1517-FBGA package, providing robust security and reliability for industrial and aerospace systems.
