Intel 5SGXMA3E2H29I3N

5SGXMA3E2H29I3N


  • Manufacturer: Intel
  • CONEVO NO: 5SGXMA3E2H29I3N
  • Package: 780-BBGA, FCBGA
  • Datasheet: PDF
  • Stock: In stock
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Parameters
Series Stratix® V GX
Moisture Sensitivity Level (MSL) 3 (168 Hours)
RoHS Status RoHS Compliant
Package / Case 780-BBGA, FCBGA
Mfr Intel
Mounting Type Surface Mount
Operating Temperature -40°C ~ 100°C (TJ)
Supplier Device Package 780-HBGA (33x33)
Number of I/O 600
Voltage - Supply 0.82V ~ 0.88V
Number of Logic Elements/Cells 340000
Number of LABs/CLBs 128300
Total RAM Bits 19456000
Package Tray
Product Status Obsolete
Conevo-Key Programmable Not Verified
Base Product Number 5SGXMA3
Other Names 972258
Standard Package 24
ECCN 3A001A2C
HTSUS 8542.39.0001

5SGXMA3E2H29I3N FPGA Chip Stratix® V GX Field Programmable Gate Array

The 5SGXMA3E2H29I3N is a high-performance FPGA from Intel's (formerly Altera) Stratix® V GX family, built on a cutting-edge 28nm low-power (28LP) process technology. This device features 1,020,000 logic elements (LEs) and 48,576 adaptive logic modules (ALMs), enabling complex parallel processing for demanding applications such as high-speed data communication, 5G wireless infrastructure, and advanced test/measurement systems. Packaged in a 1,152-ball Flip-Chip Ball Grid Array (FCBGA) with a 29mm x 29mm footprint, it supports up to 600 high-speed I/Os, making it ideal for multi-protocol interfacing. The chip operates at a core voltage of 0.87V–0.93V, achieving up to 40% lower power consumption compared to previous generations while maintaining a maximum clock frequency of 600 MHz for optimal performance-per-watt.

5SGXMA3E2H29I3N Stratix V FPGA Applications and Use Cases

This FPGA excels in high-bandwidth, low-latency environments. In 5G base stations, it accelerates massive MIMO processing and beamforming, reducing end-to-end latency by 30% compared to ASICs. For financial trading systems, its ultra-low jitter (sub-100ps) and deterministic latency enable high-frequency trading (HFT) platforms to execute trades in microseconds. In aerospace, its radiation-tolerant design and SECDECC error correction support satellite communication and navigation systems. The chip is also deployed in optical transport networks (OTN) for 400G/800G line-card processing, leveraging its transceivers to handle multiplexed data streams efficiently. Its support for OpenCL and HLS tools simplifies software-to-hardware acceleration for AI inference workloads.

Alternative FPGA  Models and Features

● 5SGXMA3K2F35C2N: A variant with 1,020,000 LEs and 352 transceivers, optimized for 100G Ethernet line cards with reduced power consumption.

● 5SGXEA7N2F45C2N: Part of the Stratix V E family, it offers 2,340,000 LEs and 96 transceivers, targeting high-density computing tasks like cloud-scale AI training.

● 5SGXMA5K3F40I3N: Features 1,540,000 LEs and 400 transceivers, designed for 5G NR gNodeB applications requiring multi-band carrier aggregation.

● 10AX115S2F45I1SG: From the Agilex™ family, this next-gen FPGA provides 1,150,000 LEs and 112 transceivers with 30% lower power, ideal for edge computing.

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