5SGXMA3K2F35C2N
| Parameters | |
|---|---|
| Series | Stratix® V GX |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| RoHS Status | RoHS Compliant |
| Package / Case | 1152-BBGA, FCBGA |
| Mfr | Intel |
| Mounting Type | Surface Mount |
| Operating Temperature | 0°C ~ 85°C (TJ) |
| Supplier Device Package | 1152-FBGA (35x35) |
| Number of I/O | 600 |
| Voltage - Supply | 0.87V ~ 0.93V |
| Number of Logic Elements/Cells | 340000 |
| Number of LABs/CLBs | 128300 |
| Total RAM Bits | 19456000 |
| Package | Tray |
| Product Status | Obsolete |
| Conevo-Key Programmable | Not Verified |
| Base Product Number | 5SGXMA3 |
| Other Names | 971538 |
| Standard Package | 24 |
| ECCN | 3A001A2C |
| HTSUS | 8542.39.0001 |
5SGXMA3K2F35C2N Stratix V FPGA IC
The 5SGXMA3K2F35C2N is a Stratix V GX FPGA, designed for high-speed, low-latency applications requiring advanced signal processing and flexible I/O capabilities. Built on a 28nm process technology, it integrates 3 million logic elements (LEs), 1,440 18x18 multipliers, and 12.8Mbits of embedded RAM, enabling complex computational tasks such as video processing, 5G baseband processing, and high-frequency trading. The device supports up to 24 transceiver channels operating at 6.25–12.5Gbps, making it ideal for high-speed serial interfaces like PCIe Gen3, 100G Ethernet, and CPRI. It features a robust power management system with dynamic voltage scaling and partial reconfiguration capabilities, reducing energy consumption by up to 50% in low-utilization scenarios.
5SGXMA3K2F35C2N High-Performance FPGA Key Features
The 5SGXMA3K2F35C2N offers a high-performance architecture with a 1.2V core voltage and 0.9V to 1.1V I/O voltage range, supporting multi-voltage operation for compatibility with various standards. Its 24 transceivers provide flexible data rates (6.25–12.5Gbps) and support protocols like PCIe Gen3 x8, 100G Ethernet (CAUI-4), and CPRI Option 10. The FPGA includes 1,440 variable-precision DSP blocks (18x18 or 27x27 multipliers) for efficient signal processing, along with 12.8Mbits of embedded M20K RAM for high-speed data buffering. It supports up to 1,152 user I/Os with programmable slew rates and drive strengths, enabling seamless integration with external devices. The device operates across a -40°C to +100°C industrial temperature range and features 3,000-ball FBGA packaging (35mm x 35mm) for high-density mounting.
Alternative FPGA Solutions
● Xilinx Virtex-7 XC7VX690T-2FFG1761C: A high-end FPGA with 693K logic cells and 3,600 DSP slices, optimized for 400G networking and ASIC prototyping.
● Microsemi SmartFusion2 SoC FPGA (M2S090TS-1FGG484I): Combines FPGA logic with an ARM Cortex-M3 processor, targeting secure industrial control and IoT applications.
● Lattice ECP5 LFE5UM-85F-8BG554I: A cost-effective FPGA with 85K LUTs and 224 18x18 multipliers, ideal for low-power video bridging and motor control.
