5SGXMA3K2F40I2LN
| Parameters | |
|---|---|
| Series | Stratix® V GX |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| RoHS Status | RoHS Compliant |
| Package / Case | 1517-BBGA, FCBGA |
| Mfr | Intel |
| Mounting Type | Surface Mount |
| Operating Temperature | -40°C ~ 100°C (TJ) |
| Supplier Device Package | 1517-FBGA (40x40) |
| Number of I/O | 600 |
| Voltage - Supply | 0.82V ~ 0.88V |
| Number of Logic Elements/Cells | 340000 |
| Number of LABs/CLBs | 128300 |
| Total RAM Bits | 19456000 |
| Package | Tray |
| Product Status | Obsolete |
| Conevo-Key Programmable | Not Verified |
| Base Product Number | 5SGXMA3 |
| Other Names | 970518 |
| Standard Package | 21 |
| ECCN | 3A001A2C |
| HTSUS | 8542.39.0001 |
5SGXMA3K2F40I2LN Intel Stratix V GX FPGA IC 600 19456000 340000
The 5SGXMA3K2F40I2LN is an advanced, high-bandwidth Field Programmable Gate Array (FPGA) from Intel's renowned Stratix V GX family, fabricated on a high-performance 28nm low-power process. Engineered to address the insatiable data throughput demands of modern digital systems, this FPGA seamlessly integrates a massive programmable logic fabric with highly reliable, multi-gigabit serial transceivers. Packaged in a premium fine-pitch BGA footprint, this FPGA is meticulously designed for high-throughput, mission-critical applications in harsh environments where uncompromising data integrity, extreme signal processing capabilities, and long-term hardware reliability are absolutely essential.
5SGXMA3K2F40I2LN FPGA Highlights & Application Scenarios
● 28nm High-Density Fabric: Delivers massive parallel processing power and logic density, enabling the integration of complex ASIC-level functionalities into a single reprogrammable platform.
● Integrated 12.5Gbps Transceivers: Features embedded high-speed serial transceivers that eliminate the need for discrete SERDES components, drastically reducing board space and power dissipation.
● Hard Memory Controllers: Includes specialized hardware interfaces that maximize external DDR3 memory bandwidth while relieving the FPGA fabric from complex memory timing constraints.
● Wireless Infrastructure: Ideal for 4G/LTE base stations and remote radio heads, handling massive MIMO data streams and high-speed CPRI/OBSAI fronthaul protocols.
● Military & Aerospace: Suited for radar signal processing, software-defined radio (SDR), and secure tactical communications operating reliably in extreme thermal conditions.
● High-Speed Test Equipment: Drives the massive data acquisition and real-time digital signal processing required in advanced oscilloscopes and logic analyzers.
Alternative FPGA chip Models
1. XC7K325T-2FFG900I (AMD/Xilinx): A highly competitive 28nm Kintex-7 FPGA offering similar logic density and integrated 6.6Gbps GTP transceivers tailored for high-performance DSP and mid-range serial connectivity.
2. MPF300T-1FCG1156I (Microchip): A mid-range PolarFire FPGA leveraging non-volatile flash architecture for ultra-low power and high security, equipped with 12.7Gbps transceivers ideal for aerospace applications.
3. 10CX220YF780I5G (Intel): A cost-optimized Cyclone 10 GX device providing integrated 12.5Gbps transceivers and a significantly lower power footprint for commercial high-throughput systems.
