Intel EP3C25Q240C8N


  • Manufacturer: Intel
  • CONEVO NO: EP3C25Q240C8N
  • Package: 240-BFQFP
  • Datasheet: PDF
  • Stock: In stock
  • Description: EP3C25Q240C8N(Kg)



Series Cyclone® III
Moisture Sensitivity Level (MSL) 3 (168 Hours)
RoHS Status RoHS Compliant
Package / Case 240-BFQFP
Mfr Intel
Mounting Type Surface Mount
Operating Temperature 0°C ~ 85°C (TJ)
Supplier Device Package 240-PQFP (32x32)
Number of I/O 148
Voltage - Supply 1.15V ~ 1.25V
Number of Logic Elements/Cells 24624
Number of LABs/CLBs 1539
Total RAM Bits 608256
Package Tray
Product Status Active
Conevo-Key Programmable Not Verified
Base Product Number EP3C25
REACH Status REACH Unaffected
Standard Package 24
HTSUS 8542.32.0071

Cyclone® III Field Programmable Gate Array (FPGA) IC 148 608256 24624 240-BFQFP

EP3C25Q240C8N Description

The EP3C25Q240C8N from the Intel Cyclone®III series is a multifunction FPGA chip. The chip is packaged in a pallet and 240-BFQFP package, and its small size makes it suitable for a wide range of applications. The FPGA has 1539 lab/CLBS and 24,624 logic elements/units. The EP3C25Q240C8N has a large memory capacity with 608256 bits of RAM. Second, the electronics also have 148 I/O options to connect with a variety of external devices and systems. To maximize the efficient and reliable performance of the FPGA, the device operates at a voltage of 1.15V to 1.25V. EP3C25Q240C8N is designed for surface mount and can be easily integrated into PCB designs. It is capable of operating effectively in the temperature range from 0°C to 85°C. In addition, the FPGA's crystal oscillator frequency is 472.5MHz.


Series: Cyclone® III

Package: Tray

Package / Case: 240-BFQFP

Number of LABs/CLBs: 1539

Number of Logic Elements/Cells: 24624

Total RAM Bits: 608256

Number of I/O: 148

Voltage - Supply: 1.15V ~ 1.25V

Mounting Type: Surface Mount

Operating Temperature: 0°C ~ 85°C (TJ)



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