EP4SGX230HF35C2N
| Parameters | |
|---|---|
| Series | Stratix® IV GX |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| RoHS Status | RoHS Compliant |
| Package / Case | 1152-BBGA, FCBGA |
| Mfr | Intel |
| Mounting Type | Surface Mount |
| Operating Temperature | 0°C ~ 85°C (TJ) |
| Supplier Device Package | 1152-FBGA (35x35) |
| Number of I/O | 564 |
| Voltage - Supply | 0.87V ~ 0.93V |
| Number of Logic Elements/Cells | 228000 |
| Number of LABs/CLBs | 9120 |
| Total RAM Bits | 17544192 |
| Package | Tray |
| Product Status | Obsolete |
| Conevo-Key Programmable | Not Verified |
| Base Product Number | EP4SGX230 |
| Standard Package | 24 |
| ECCN | 3A001A7A |
| HTSUS | 8542.39.0001 |
EP4SGX230HF35C2N Stratix IV GX High-End FPGA IC 564 17544192 228000
EP4SGX230HF35C2N is a high-performance SRAM-based Stratix IV GX FPGA originally designed by Altera, now under Intel product portfolio, fabricated on advanced 40nm process and enclosed within a 35×35mm 1152-ball FC-FBGA surface-mount tray package with MSL3 moisture rating and full RoHS compliance for industrial automated SMT assembly. This commercial-grade chip runs at junction temperature from 0°C to +85°C, equipped with 228,000 adaptive logic modules, 17.54Mbit embedded block RAM, abundant high-speed transceiver banks, and 564 user general I/Os alongside multi-voltage I/O bank support covering 1.2V to 3.3V logic standards. Though marked obsolete by official production lines, it remains widely stocked for legacy high-speed communication, signal processing and high-density reconfigurable system upgrades that demand robust multi-gigabit serial link capability and massive parallel logic resources.
It serves as a core high-speed reconfigurable processor deployed in wireless base station radio cards, optical transport network switching boards, radar signal processing platforms, high-speed video broadcast equipment, large-scale test measurement instrumentation and high-performance computing acceleration cards, catering to mission-critical systems requiring simultaneous multi-channel gigabit serial communication and heavy parallel digital computation workloads that mid-range FPGAs cannot fulfill.
Alternative FPGA chips
● EP4SGX230HF35I4N (Intel): Pin-to-pin industrial grade variant supporting -40°C~+100°C junction temperature for harsh environment direct PCB drop-in replacement.
● XC7VX240T-2FFG1158C (AMD Xilinx): Virtex-7 high-transceiver FPGA with similar logic scale and gigabit serial performance as cross-brand second-source upgrade solution.
● AGLX230-FC1152 (Achronix): Speedster21 high-density FPGA with comparable transceiver bandwidth and package footprint for low-latency networking hardware redesign.
