Intel EPM1270F256C3N


  • Manufacturer: Intel
  • CONEVO NO: EPM1270F256C3N
  • Package: 256-BGA
  • Datasheet: PDF
  • Stock: In stock
  • Description: EPM1270F256C3N(Kg)



Series MAX® II
Moisture Sensitivity Level (MSL) 3 (168 Hours)
RoHS Status RoHS Compliant
Package / Case 256-BGA
Mfr Intel
Mounting Type Surface Mount
Operating Temperature 0°C ~ 85°C (TJ)
Supplier Device Package 256-FBGA (17x17)
Number of I/O 212
Programmable Type In System Programmable
Voltage Supply - Internal 2.5V, 3.3V
Number of Logic Elements/Blocks 1270
Delay Time tpd(1) Max 6.2 ns
Number of Macrocells 980
Package Tray
Product Status Active
Digi-Key Programmable Not Verified
Base Product Number EPM1270
REACH Status REACH Unaffected
Standard Package 90
HTSUS 8542.39.0001

EPM1270F256C3N  Description

The EPM1270F256C3N(Electronic Components)  is manufactured by Intel and belongs to the MAX® II Series. The EPM1270F256C3N integrated circuit(Complex Programmable Logic Device)  is packaged in a 256-FBGA (17x17) package. The umber of Logic Elements/Blocks is 1270, and the number of Macrocells is 980.  During operation, the tempeturate betwwen 0°C ~ 85°C,  which ensure its reliability.  And It is recommended to mount the chip by Surface Mount.


Operate Tempeturate:  0°C ~ 85°C

Power supplies: 1.5/3.32.5/3.3V

Mounting type: Surface Mount

Package: 256-FBGA (17x17) package


Complex programmable logic device

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