Intel EPM1270F256C3N
| Parameters | |
|---|---|
| Series | MAX® II |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| RoHS Status | RoHS Compliant |
| Package / Case | 256-BGA |
| Mfr | Intel |
| Mounting Type | Surface Mount |
| Operating Temperature | 0°C ~ 85°C (TJ) |
| Supplier Device Package | 256-FBGA (17x17) |
| Number of I/O | 212 |
| Programmable Type | In System Programmable |
| Voltage Supply - Internal | 2.5V, 3.3V |
| Number of Logic Elements/Blocks | 1270 |
| Delay Time tpd(1) Max | 6.2 ns |
| Number of Macrocells | 980 |
| Package | Tray |
| Product Status | Active |
| Conevo-Key Programmable | Not Verified |
| Base Product Number | EPM1270 |
| REACH Status | REACH Unaffected |
| Standard Package | 90 |
| ECCN | 3A001A7A |
| HTSUS | 8542.39.0001 |
EPM1270F256C3N Description
The EPM1270F256C3N(Electronic Components) is manufactured by Intel and belongs to the MAX® II Series. The EPM1270F256C3N integrated circuit(Complex Programmable Logic Device) is packaged in a 256-FBGA (17x17) package. The umber of Logic Elements/Blocks is 1270, and the number of Macrocells is 980. During operation, the tempeturate betwwen 0°C ~ 85°C, which ensure its reliability. And It is recommended to mount the chip by Surface Mount.
Features
Operate Tempeturate: 0°C ~ 85°C
Power supplies: 1.5/3.32.5/3.3V
Mounting type: Surface Mount
Package: 256-FBGA (17x17) package
Applications
Complex programmable logic device
Electronic Components
Portable digital devices
Handheld digital devices
Battery operated portable devices
Intelligent devices
