Intel EPM2210F256I5N
| Parameters | |
|---|---|
| Series | MAX® II |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| RoHS Status | RoHS Compliant |
| Package / Case | 256-BGA |
| Mfr | Intel |
| Mounting Type | Surface Mount |
| Operating Temperature | -40°C ~ 100°C (TJ) |
| Supplier Device Package | 256-FBGA (17x17) |
| Number of I/O | 204 |
| Programmable Type | In System Programmable |
| Voltage Supply - Internal | 2.5V, 3.3V |
| Number of Logic Elements/Blocks | 2210 |
| Delay Time tpd(1) Max | 7 ns |
| Number of Macrocells | 1700 |
| Package | Tray |
| Product Status | Active |
| Conevo-Key Programmable | Not Verified |
| Base Product Number | EPM2210 |
| REACH Status | REACH Unaffected |
| Standard Package | 90 |
| ECCN | 3A991D |
| HTSUS | 8542.39.0001 |
The EPM2210F256I5N is a high-performance Field-Programmable Gate Array (FPGA) from Intel's MAX® 10 FPGA family, designed for low-power, cost-sensitive applications. It features 2,210 logic elements (LEs) and 80Kbits of embedded memory, making it suitable for control logic, signal processing, and embedded system designs. Built on a 55nm process technology, this FPGA offers a balance of power efficiency and performance, supporting instant-on operation and non-volatile configuration storage, eliminating the need for external configuration devices.
The device operates within a wide voltage range (1.15V to 3.3V) and supports flexible I/O standards, including LVCMOS, LVDS, and PCI Express, ensuring compatibility with various interfaces. It includes embedded multipliers, PLLs (Phase-Locked Loops), and user flash memory, enabling efficient clock management and data storage. The 256-pin FineLine BGA package (F256) ensures compact PCB integration while providing robust thermal and electrical performance for industrial applications.
Targeting industrial, automotive, and consumer electronics, the EPM2210F256I5N supports -40°C to 100°C (Industrial-grade) operation, making it ideal for harsh environments. Its low static power consumption and fast reconfiguration enhance energy efficiency and system responsiveness. Additionally, the chip supports in-system programmability (ISP) via JTAG or active serial interfaces, simplifying firmware updates and prototyping.
Alternative FPGA Models & Key Features:
● EPM2210F324I5N: 324-pin BGA, higher I/O count, similar logic capacity.
● EPM240T100C5N: Smaller 240 LE capacity, 100-pin TQFP, cost-optimized.
● EPM570F256I5N: Larger 570 LE capacity, same package, enhanced processing.
● EPM1270F256C5N: 1,270 LEs, commercial temperature range (0°C to 85°C).
