Intel EPM2210F256I5N

EPM2210F256I5N


  • Manufacturer: Intel
  • CONEVO NO: EPM2210F256I5N
  • Package: 256-BGA
  • Datasheet: PDF
  • Stock: In stock
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Details

Tags

Parameters
Series MAX® II
Moisture Sensitivity Level (MSL) 3 (168 Hours)
RoHS Status RoHS Compliant
Package / Case 256-BGA
Mfr Intel
Mounting Type Surface Mount
Operating Temperature -40°C ~ 100°C (TJ)
Supplier Device Package 256-FBGA (17x17)
Number of I/O 204
Programmable Type In System Programmable
Voltage Supply - Internal 2.5V, 3.3V
Number of Logic Elements/Blocks 2210
Delay Time tpd(1) Max 7 ns
Number of Macrocells 1700
Package Tray
Product Status Active
Conevo-Key Programmable Not Verified
Base Product Number EPM2210
REACH Status REACH Unaffected
Standard Package 90
ECCN 3A991D
HTSUS 8542.39.0001
EPM2210F256I5N MAX 10 FPGA embedded memory FPGA Chip Detailed Overview

The EPM2210F256I5N is a high-performance Field-Programmable Gate Array (FPGA) from Intel's MAX® 10 FPGA family, designed for low-power, cost-sensitive applications.  It features 2,210 logic elements (LEs) and 80Kbits of embedded memory, making it suitable for control logic, signal processing, and embedded system designs.  Built on a 55nm process technology, this FPGA offers a balance of power efficiency and performance, supporting instant-on operation and non-volatile configuration storage, eliminating the need for external configuration devices.

The device operates within a wide voltage range (1.15V to 3.3V) and supports flexible I/O standards, including LVCMOS, LVDS, and PCI Express, ensuring compatibility with various interfaces.  It includes embedded multipliers, PLLs (Phase-Locked Loops), and user flash memory, enabling efficient clock management and data storage.  The 256-pin FineLine BGA package (F256) ensures compact PCB integration while providing robust thermal and electrical performance for industrial applications.

Targeting industrial, automotive, and consumer electronics, the EPM2210F256I5N supports -40°C to 100°C (Industrial-grade) operation, making it ideal for harsh environments.  Its low static power consumption and fast reconfiguration enhance energy efficiency and system responsiveness.  Additionally, the chip supports in-system programmability (ISP) via JTAG or active serial interfaces, simplifying firmware updates and prototyping.

Alternative FPGA Models & Key Features:

EPM2210F324I5N: 324-pin BGA, higher I/O count, similar logic capacity.

EPM240T100C5N: Smaller 240 LE capacity, 100-pin TQFP, cost-optimized.

EPM570F256I5N: Larger 570 LE capacity, same package, enhanced processing.

EPM1270F256C5N: 1,270 LEs, commercial temperature range (0°C to 85°C).

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