THGBMJG6C1LBAU7

THGBMJG6C1LBAU7


  • Manufacturer: Kioxia America, Inc.
  • CONEVO NO: THGBMJG6C1LBAU7
  • Package: 153-WFBGA
  • Stock: In stock
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Parameters
Supplier Device Package 153-WFBGA (11.5x13)
Memory Size 64Gbit
Memory Type Non-Volatile
Voltage - Supply -
Memory Organization 8G x 8
Memory Format FLASH
Memory Interface eMMC
Write Cycle Time - Word, Page -
Package Tray
Product Status Active
Base Product Number THGBMJG6
REACH Status REACH Unaffected
Standard Package 152
ECCN 3A991B1A
HTSUS 8542.32.0071
Series e•MMC™
Moisture Sensitivity Level (MSL) 3 (168 Hours)
RoHS Status ROHS3 Compliant
Package / Case 153-WFBGA
Mfr Kioxia America, Inc.
Mounting Type Surface Mount
Operating Temperature -40°C ~ 105°C (TA)
Technology FLASH - NAND

THGBMJG6C1LBAU7 e•MMC memory IC 64Gbit 153-WFBGA

THGBMJG6C1LBAU7 is a 16GB industrial-grade embedded MultiMediaCard (e•MMC) memory IC manufactured by Kioxia (formerly Toshiba Memory), built on mature 15nm MLC NAND flash process and fully compliant with JEDEC e•MMC 5.1 standard to deliver integrated, fully managed mass storage for embedded electronic systems. Classified as AEC-Q100 qualified extended-temperature variant, it supports continuous stable operation across -40°C to +105°C, far exceeding standard consumer eMMC temperature limits, making it resistant to extreme thermal fluctuations in outdoor and factory environments, while meeting RoHS environmental compliance standards for global market deployment. Its dual voltage design separates core flash supply (2.7V–3.6V) and interface IO supply (1.7V–1.95V), balancing reliable flash cell operation and low-power signal transmission for battery-powered embedded devices, with configurable x1, x4, x8 bus widths to match different host SoC interface bandwidth demands.

THGBMJG6C1LBAU7 targets multi-scenario embedded storage deployments that demand wide-temperature tolerance and dependable non-volatile storage, covering industrial automation equipment such as PLC controllers, factory human-machine touch panels and industrial gateway modules for persistent storage of configuration files and production log data. It fits automotive auxiliary electronic systems including dashboard displays, vehicle-mounted monitoring terminals and car smart sensor hubs, where extreme temperature swings inside vehicle cabins and engine compartments require robust flash memory performance. The chip also serves outdoor IoT hardware like smart metering devices, solar monitoring terminals and outdoor security cameras, as well as mid-tier consumer electronics such as entry-level tablets, portable media players and smart home control panels that need compact, cost-effective embedded storage without high-speed UFS requirements. Additionally, it works well with medical portable diagnostic devices and edge computing mini-modules, delivering stable local data caching and operating system storage under continuous long-duration running states.

Alternative eMMC Solutions

● THGBMHG7C2LBAW7: 16GB consumer-grade 15nm MLC eMMC 5.1 chip with standard -25°C to +85°C temperature range, identical 153-ball FBGA footprint for pin-to-pin drop-in replacement in indoor consumer devices with lower thermal tolerance demands.

● THGBMJG8C4LBAU8: 32GB industrial extended-temperature eMMC from the same Kioxia 15nm MLC product line, sharing -40°C~+105°C operating range and identical package to upgrade storage capacity without PCB redesign.

● MTFC16GAP-0M WT: Micron 16GB industrial eMMC 5.1 memory IC supporting wide temperature operation, offering equivalent 400MB/s sequential read speed and cross-brand substitute for multi-source hardware BOM diversification.

● THGBMJG6C1LBAIL: Kioxia 16GB standard-temperature eMMC variant with simplified industrial feature set, lower unit cost for cost-sensitive indoor embedded equipment without harsh environment exposure.

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