THGBMJG8C2LBAIL
| Parameters | |
|---|---|
| Series | e•MMC™ |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| RoHS Status | ROHS3 Compliant |
| Package / Case | 153-WFBGA |
| Mfr | Kioxia America, Inc. |
| Mounting Type | Surface Mount |
| Operating Temperature | -25°C ~ 85°C (TA) |
| Technology | FLASH - NAND |
| Supplier Device Package | 153-WFBGA (11.5x13) |
| Memory Size | 256Gbit |
| Memory Type | Non-Volatile |
| Voltage - Supply | - |
| Memory Organization | 32G x 8 |
| Memory Format | FLASH |
| Memory Interface | eMMC |
| Write Cycle Time - Word, Page | - |
| Package | Tray |
| Product Status | Obsolete |
| Base Product Number | THGBMJG8 |
| REACH Status | REACH Unaffected |
| Standard Package | 152 |
| ECCN | 3A991B1A |
| HTSUS | 8542.32.0071 |
THGBMJG8C2LBAIL 32GB eMMC 5.1 NAND Flash Memory Device
The THGBMJG8C2LBAIL is a high-density embedded multimedia card (eMMC) module manufactured by Kioxia America, Inc. (formerly Toshiba Memory). This non-volatile FLASH NAND memory device delivers 256 Gbit (32 GB) of storage capacity and is organized as 32G × 8 bits. Housed in a compact 153-ball WFBGA (Wafer-Level Fine-Pitch Ball Grid Array) package measuring 11.5 mm × 13 mm with a maximum height of just 0.8 mm, the device is designed for space-constrained embedded applications requiring substantial onboard storage. The part is RoHS3 compliant, REACH unaffected, and carries ECCN 3A991B1A classification.
The THGBMJG8C2LBAIL integrates an advanced NAND flash memory array with a dedicated controller chip in a multi-chip module architecture. It operates with an eMMC memory interface compliant with the JEDEC/MMCA standard version 5.1, supporting 1-bit, 4-bit, and 8-bit I/O modes for flexible bus width configuration. The device requires a VCCQ (controller) supply voltage of either 1.7 V to 1.95 V or 2.7 V to 3.6 V, while the VCCF (NAND) operating voltage ranges from 2.7 V to 3.6 V. It is rated for industrial-grade operation across an ambient temperature range of -25°C to +85°C, with a storage temperature range extending from -40°C to 85°C. The package features a 0.50 mm ball pitch and is supplied in tray packaging with a standard quantity of 152 units per tray.
Alternative NAND flash Models
For designs requiring a drop-in or functionally equivalent replacement, the following alternative models from Kioxia and other manufacturers are worth considering:
● THGBMHG8C2LBAIL – A 32 GB eMMC 5.1 device in identical WFBGA-153 package with the same 2.7 V–3.6 V operating voltage and -25°C to +85°C temperature range, offering near-identical electrical and mechanical characteristics.
● THGBMUG8C2LBAIL – A functionally similar 32 GB eMMC module from the same Kioxia family, maintaining the BGA-153 footprint and eMMC 5.1 interface for straightforward design migration.
● MTFC32GAP AKEA-WT – A 32 GB eMMC NAND flash device from Micron, offered in BGA-153 package with compatible 2.7 V–3.6 V supply and 52 MHz clock support.
● FC51L04SMSA-2.5BWGE – A managed NAND flash solution with 32 GB capacity and eMMC 5.1 interface, packaged in BGA-153 for seamless hardware compatibility.
