THGBMJG9C8LBAU8
| Parameters | |
|---|---|
| Series | e•MMC™ |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| RoHS Status | ROHS3 Compliant |
| Package / Case | 153-WFBGA |
| Mfr | Kioxia America, Inc. |
| Mounting Type | Surface Mount |
| Operating Temperature | -40°C ~ 105°C (TA) |
| Technology | FLASH - NAND |
| Supplier Device Package | 153-WFBGA (11.5x13) |
| Memory Size | 512Gbit |
| Memory Type | Non-Volatile |
| Voltage - Supply | - |
| Memory Organization | 64G x 8 |
| Memory Format | FLASH |
| Memory Interface | eMMC |
| Write Cycle Time - Word, Page | - |
| Package | Tray |
| Product Status | Active |
| Base Product Number | THGBMJG9 |
| REACH Status | REACH Unaffected |
| Standard Package | 152 |
| ECCN | 3A991B1A |
| HTSUS | 8542.32.0071 |
THGBMJG9C8LBAU8 embedded flash memory IC 512Gbit eMMC 153-WFBGA
The THGBMJG9C8LBAU8 is a 512Gbit (64GB) managed TLC NAND eMMC embedded flash memory IC manufactured by Kioxia, adopting mature BiCS FLASH 3D NAND process and fully compliant with JEDEC eMMC 5.1 industrial standard, integrating built-in dedicated memory controller to eliminate host-side flash management workloads and deliver stable non-volatile mass storage for embedded electronic systems. This component adopts compact 153-ball WFBGA packaging, supports surface-mount soldering, meets RoHS 3 environmental compliance standards with MSL 3 moisture sensitivity level, and serves as a cost-effective high-density storage alternative for devices unable to adopt UFS high-speed interfaces.
This 64GB eMMC chip is widely deployed in mid-range Android smartphones, entry-level tablets, smart TV mainboards, portable media streaming players, intelligent voice speakers, low-power IoT edge terminals, portable industrial monitoring instruments, smart home control panels and automotive auxiliary infotainment equipment, perfectly matching medium-capacity storage demands for system boot firmware, local video/audio cache, user document storage and sensor data logging, balancing storage density, cost and power efficiency for mass-produced consumer embedded hardware.
Alternative eMMC chips
● THGAMVG9T23BAU8: Kioxia original upgraded 64GB BiCS3 eMMC 5.1 chip with identical 153WFBGA pinout, optimized TLC endurance for industrial continuous write applications and direct pin-to-pin replacement without PCB modification.
● THGBMJG8C4LBAU8: Kioxia 256Gbit (32GB) eMMC 5.1 MLC flash variant sharing the same package and voltage specs, ideal capacity downgrade alternative for cost-sensitive low-data-volume IoT devices.
● KMQN10006M-B318: SK Hynix 64GB eMMC 5.1 TLC memory with matching 11.5×13mm FBGA footprint, mainstream cross-brand substitute compatible with most mobile and tablet host SoCs for aftermarket repair and mass production replacement.
● THGBMHG9C8LBAWG: Kioxia same-generation 64GB consumer-grade eMMC chip with identical electrical parameters, slight suffix variation for supply channel differentiation and fully interchangeable in standard consumer electronics circuits.
