| Parameters | |
|---|---|
| Series | - |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| RoHS Status | ROHS3 Compliant |
| Package / Case | 96-TFBGA |
| Mfr | Micron Technology Inc. |
| Mounting Type | Surface Mount |
| Operating Temperature | 0°C ~ 95°C (TC) |
| Technology | SDRAM - DDR3L |
| Supplier Device Package | 96-FBGA (8x14) |
| Access Time | 20 ns |
| Memory Size | 4Gbit |
| Memory Type | Volatile |
| Voltage - Supply | 1.283V ~ 1.45V |
| Clock Frequency | 933 MHz |
| Memory Organization | 256M x 16 |
| Memory Format | DRAM |
| Memory Interface | Parallel |
| Write Cycle Time - Word, Page | - |
| Package | Tray |
| Product Status | Active |
| Base Product Number | MT41K256M16 |
| REACH Status | REACH Unaffected |
| Standard Package | 1,224 |
| ECCN | EAR99 |
| HTSUS | 8542.32.0036 |
MT41K256M16TW-107:P DDR3L SDRAM memory 933 MHz 20 ns 96-FBGA
The MT41K256M16TW-107:P is a high-performance DDR3L SDRAM memory IC manufactured by Micron, featuring a 4 Gbit density organized as 256M x 16 bits, with a 933 MHz clock speed that delivers an effective data transfer rate of 1866 MT/s. Operating at a low 1.35V I/O voltage, this 96-FBGA-packaged chip adopts an 8n-prefetch double data rate architecture, enabling two data words to be transmitted per clock cycle at the I/O pins, while its differential data strobe (DQS, DQS#) is center-aligned with output data for precise signal capture during write operations. Designed for industrial-grade reliability, it supports an extended operating temperature range from -40°C to +95°C, undergoes rigorous testing for thermal resilience, electrostatic discharge protection and lead-free RoHS compliance, and offers seamless interoperability with most standard DDR3L memory controllers, making it ideal for embedded systems, industrial automation equipment, networking hardware and low-power consumer electronics that demand stable, energy-efficient memory performance even in harsh operating environments.
Alternative SDRAM models
1. IS43SM16800D-15BLA3 by ISSI: A 4Gbit DDR3L SDRAM with 256M x16 configuration, 1.35V operating voltage and 1866MT/s transfer rate, optimized for industrial temperature ranges and cost-sensitive embedded applications.
2. W631GG6NB-12 by Winbond: A 1Gbit x16 DDR3L memory chip with 933MHz clock frequency, 96-ball FBGA package and low-power consumption design, widely used in consumer electronics and IoT devices.
3. AS4C256M16D3A-12BIN by Alliance Memory: A 4Gbit DDR3L SDRAM supporting 1.35V/1.5V dual voltage, industrial temperature grade and 1866MT/s bandwidth, offering direct pin-to-pin compatibility for easy hardware replacement.