MT41K256M16TW-107:P

MT41K256M16TW-107:P


  • Manufacturer: Micron Technology Inc.
  • CONEVO NO: MT41K256M16TW-107:P
  • Package: 96-TFBGA
  • Datasheet: PDF
  • Stock: In stock
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Parameters
Series -
Moisture Sensitivity Level (MSL) 3 (168 Hours)
RoHS Status ROHS3 Compliant
Package / Case 96-TFBGA
Mfr Micron Technology Inc.
Mounting Type Surface Mount
Operating Temperature 0°C ~ 95°C (TC)
Technology SDRAM - DDR3L
Supplier Device Package 96-FBGA (8x14)
Access Time 20 ns
Memory Size 4Gbit
Memory Type Volatile
Voltage - Supply 1.283V ~ 1.45V
Clock Frequency 933 MHz
Memory Organization 256M x 16
Memory Format DRAM
Memory Interface Parallel
Write Cycle Time - Word, Page -
Package Tray
Product Status Active
Base Product Number MT41K256M16
REACH Status REACH Unaffected
Standard Package 1,224
ECCN EAR99
HTSUS 8542.32.0036

MT41K256M16TW-107:P DDR3L SDRAM memory 933 MHz 20 ns 96-FBGA

The MT41K256M16TW-107:P is a high-performance DDR3L SDRAM memory IC manufactured by Micron, featuring a 4 Gbit density organized as 256M x 16 bits, with a 933 MHz clock speed that delivers an effective data transfer rate of 1866 MT/s. Operating at a low 1.35V I/O voltage, this 96-FBGA-packaged chip adopts an 8n-prefetch double data rate architecture, enabling two data words to be transmitted per clock cycle at the I/O pins, while its differential data strobe (DQS, DQS#) is center-aligned with output data for precise signal capture during write operations. Designed for industrial-grade reliability, it supports an extended operating temperature range from -40°C to +95°C, undergoes rigorous testing for thermal resilience, electrostatic discharge protection and lead-free RoHS compliance, and offers seamless interoperability with most standard DDR3L memory controllers, making it ideal for embedded systems, industrial automation equipment, networking hardware and low-power consumer electronics that demand stable, energy-efficient memory performance even in harsh operating environments.

Alternative SDRAM models

1. IS43SM16800D-15BLA3 by ISSI: A 4Gbit DDR3L SDRAM with 256M x16 configuration, 1.35V operating voltage and 1866MT/s transfer rate, optimized for industrial temperature ranges and cost-sensitive embedded applications.

2. W631GG6NB-12 by Winbond: A 1Gbit x16 DDR3L memory chip with 933MHz clock frequency, 96-ball FBGA package and low-power consumption design, widely used in consumer electronics and IoT devices.

3. AS4C256M16D3A-12BIN by Alliance Memory: A 4Gbit DDR3L SDRAM supporting 1.35V/1.5V dual voltage, industrial temperature grade and 1866MT/s bandwidth, offering direct pin-to-pin compatibility for easy hardware replacement.

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