NXP USA Inc. LPC1112FDH20/102:5

LPC1112FDH20/102:5


  • Manufacturer: NXP USA Inc.
  • CONEVO NO: LPC1112FDH20/102:5
  • Package: 20-TSSOP (0.173", 4.40mm Width)
  • Datasheet: PDF
  • Stock: In stock
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Parameters
Other Names 935297033518
Standard Package 2,500
Mfr NXP USA Inc.
Series LPC1100L
Package Tape & Reel (TR)
Product Status Active
Core Processor ARM® Cortex®-M0
Core Size 32-Bit Single-Core
Speed 50MHz
Connectivity SPI, UART/USART
Peripherals Brown-out Detect/Reset, POR, WDT
Number of I/O 14
Program Memory Size 16KB (16K x 8)
Program Memory Type FLASH
EEPROM Size -
RAM Size 4K x 8
Voltage - Supply (Vcc/Vdd) 1.8V ~ 3.6V
Data Converters A/D 5x10b
Oscillator Type Internal
Operating Temperature -40°C ~ 85°C (TA)
Mounting Type Surface Mount
Package / Case 20-TSSOP (0.173", 4.40mm Width)
Supplier Device Package 20-TSSOP
Base Product Number LPC1112
RoHS Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 1 (Unlimited)
REACH Status REACH Unaffected
ECCN 3A991A2
HTSUS 8542.31.0001
ARM® Cortex®-M0 LPC1100L Microcontroller IC 32-Bit Single-Core 50MHz 16KB (16K x 8) FLASH 20-TSSOP
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