NXP USA Inc. LPC2290FBD144015

LPC2290FBD144015


  • Manufacturer: NXP USA Inc.
  • CONEVO NO: LPC2290FBD144015
  • Package: 144-LQFP
  • Datasheet: PDF
  • Stock: In stock
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Mfr NXP USA Inc.
Series LPC2200
Package Bulk
Product Status Active
Core Processor ARM7®
Core Size 16/32-Bit
Speed 60MHz
Connectivity CANbus, EBI/EMI, I²C, Microwire, SPI, SSI, SSP, UART/USART
Peripherals PWM, WDT
Number of I/O 76
Program Memory Size -
Program Memory Type ROMless
EEPROM Size -
RAM Size 64K x 8
Voltage - Supply (Vcc/Vdd) 1.65V ~ 3.6V
Data Converters A/D 8x10b
Oscillator Type Internal
Operating Temperature -40°C ~ 85°C (TA)
Mounting Type Surface Mount
Package / Case 144-LQFP
Supplier Device Package 144-LQFP (20x20)
Base Product Number LPC2290
RoHS Status Not applicable
Moisture Sensitivity Level (MSL) 3 (168 Hours)
REACH Status Vendor Undefined
ECCN 3A991A2
HTSUS 8542.31.0001
Standard Package 1
ARM7® LPC2200 Microcontroller IC 16/32-Bit 60MHz ROMless 144-LQFP (20x20)
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