NXP USA Inc. LPC2926FBD144,557
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| Parameters | |
|---|---|
| Standard Package | 300 |
| Mfr | NXP USA Inc. |
| Series | LPC2900 |
| Package | Tray |
| Product Status | Not For New Designs |
| Core Processor | ARM9® |
| Core Size | 16/32-Bit |
| Speed | 125MHz |
| Connectivity | CANbus, EBI/EMI, I²C, LINbus, SPI, UART/USART, USB |
| Peripherals | DMA, POR, PWM, WDT |
| Number of I/O | 104 |
| Program Memory Size | 256KB (256K x 8) |
| Program Memory Type | FLASH |
| EEPROM Size | 16K x 8 |
| RAM Size | 56K x 8 |
| Voltage - Supply (Vcc/Vdd) | 1.71V ~ 3.6V |
| Data Converters | A/D 24x10b |
| Oscillator Type | Internal |
| Operating Temperature | -40°C ~ 85°C (TA) |
| Mounting Type | Surface Mount |
| Package / Case | 144-LQFP |
| Supplier Device Package | 144-LQFP (20x20) |
| Base Product Number | LPC2926 |
| RoHS Status | ROHS3 Compliant |
| Moisture Sensitivity Level (MSL) | 2 (1 Year) |
| REACH Status | REACH Unaffected |
| ECCN | 3A991A2 |
| HTSUS | 8542.31.0001 |
| Other Names | 935293568557 |
ARM9® LPC2900 Microcontroller IC 16/32-Bit 125MHz 256KB (256K x 8) FLASH 144-LQFP (20x20)
