NXP USA Inc. LPC2939FBD208,551

LPC2939FBD208,551


  • Manufacturer: NXP USA Inc.
  • CONEVO NO: LPC2939FBD208,551
  • Package: 208-LQFP
  • Datasheet: PDF
  • Stock: In stock
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Mfr NXP USA Inc.
Series LPC2900
Package Tray
Product Status Not For New Designs
Core Processor ARM9®
Core Size 16/32-Bit
Speed 125MHz
Connectivity CANbus, EBI/EMI, I²C, LINbus, SPI, UART/USART, USB, USB OTG
Peripherals DMA, POR, PWM, WDT
Number of I/O 152
Program Memory Size 768KB (768K x 8)
Program Memory Type FLASH
EEPROM Size 16K x 8
RAM Size 56K x 8
Voltage - Supply (Vcc/Vdd) 1.71V ~ 3.6V
Data Converters A/D 24x10b
Oscillator Type Internal
Operating Temperature -40°C ~ 85°C (TA)
Mounting Type Surface Mount
Package / Case 208-LQFP
Supplier Device Package 208-LQFP (28x28)
Base Product Number LPC2939
RoHS Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 2 (1 Year)
REACH Status REACH Unaffected
ECCN 3A991A2
HTSUS 8542.31.0001
Standard Package 36
ARM9® LPC2900 Microcontroller IC 16/32-Bit 125MHz 768KB (768K x 8) FLASH 208-LQFP (28x28)
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