NXP USA Inc. MC33662BLEF

MC33662BLEF


  • Manufacturer: NXP USA Inc.
  • CONEVO NO: MC33662BLEF
  • Package: 8-SOIC (0.154", 3.90mm Width)
  • Datasheet: PDF
  • Stock: In stock
  • Description: MC33662BLEF(Kg)

Details

Tags

Parameters
Mfr NXP USA Inc.
Series -
Package Tube
Product Status Discontinued at Digi-Key
Type Transceiver
Protocol LINbus
Number of Drivers/Receivers 1/1
Duplex -
Data Rate 20kbps
Voltage - Supply 7V ~ 18V
Operating Temperature -40°C ~ 125°C
Mounting Type Surface Mount
Package / Case 8-SOIC (0.154", 3.90mm Width)
Supplier Device Package 8-SOIC
Base Product Number MC336
RoHS Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 3 (168 Hours)
REACH Status REACH Unaffected
ECCN EAR99
HTSUS 8542.39.0001
Standard Package 98
1/1 Transceiver LINbus 8-SOIC
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