NXP USA Inc. MC33662SEFR2

MC33662SEFR2


  • Manufacturer: NXP USA Inc.
  • CONEVO NO: MC33662SEFR2
  • Package: 8-SOIC (0.154", 3.90mm Width)
  • Datasheet: PDF
  • Stock: In stock
  • Description: MC33662SEFR2(Kg)

Details

Tags

Parameters
Mfr NXP USA Inc.
Series -
Package Tape & Reel (TR)
Product Status Not For New Designs
Type Transceiver
Protocol LINbus
Number of Drivers/Receivers 1/1
Duplex Half
Receiver Hysteresis 175 mV
Data Rate 20kbps
Voltage - Supply 7V ~ 18V
Operating Temperature -40°C ~ 125°C
Mounting Type Surface Mount
Package / Case 8-SOIC (0.154", 3.90mm Width)
Supplier Device Package 8-SOIC
Base Product Number MC33662
RoHS Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 3 (168 Hours)
REACH Status REACH Unaffected
ECCN EAR99
HTSUS 8542.39.0001
Other Names 935316488518
Standard Package 2,500
1/1 Transceiver Half LINbus 8-SOIC
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