NXP USA Inc. MC9S12GC64MPBE

MC9S12GC64MPBE


  • Manufacturer: NXP USA Inc.
  • CONEVO NO: MC9S12GC64MPBE
  • Package: 52-LQFP
  • Datasheet: PDF
  • Stock: In stock
  • Description: MC9S12GC64MPBE(Kg)

Details

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Parameters
Mfr NXP USA Inc.
Series HCS12
Package Tray
Product Status Active
Core Processor HCS12
Core Size 16-Bit
Speed 25MHz
Connectivity EBI/EMI, SCI, SPI
Peripherals POR, PWM, WDT
Number of I/O 35
Program Memory Size 64KB (64K x 8)
Program Memory Type FLASH
EEPROM Size -
RAM Size 4K x 8
Voltage - Supply (Vcc/Vdd) 2.35V ~ 5.5V
Data Converters A/D 8x10b
Oscillator Type Internal
Operating Temperature -40°C ~ 125°C (TA)
Mounting Type Surface Mount
Package / Case 52-LQFP
Supplier Device Package 52-TQFP (10x10)
Base Product Number MC9S12
RoHS Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 3 (168 Hours)
REACH Status REACH Unaffected
ECCN EAR99
HTSUS 8542.31.0001
Standard Package 800
HCS12 HCS12 Microcontroller IC 16-Bit 25MHz 64KB (64K x 8) FLASH 52-TQFP (10x10)
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