MCIMX283DVM4B

MCIMX283DVM4B


  • Manufacturer: NXP USA Inc.
  • CONEVO NO: MCIMX283DVM4B
  • Package: 289-LFBGA
  • Datasheet: PDF
  • Stock: In stock
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Details

Tags

Parameters
Series i.MX28
Moisture Sensitivity Level (MSL) 3 (168 Hours)
RoHS Status ROHS3 Compliant
Package / Case 289-LFBGA
Mfr NXP USA Inc.
Mounting Type Surface Mount
Operating Temperature -20°C ~ 70°C (TA)
Supplier Device Package 289-MAPBGA (14x14)
Speed 454MHz
Ethernet 10/100Mbps (1)
USB USB 2.0 + PHY (2)
SATA -
Core Processor ARM926EJ-S
Voltage - I/O 1.8V, 3.3V
Number of Cores/Bus Width 1 Core, 32-Bit
Graphics Acceleration No
RAM Controllers LVDDR, LVDDR2, DDR2
Co-Processors/DSP Data; DCP
Security Features Boot Security, Cryptography, Hardware ID
Display & Interface Controllers Keyboard, LCD, Touchscreen
Additional Interfaces I²C, I²S, MMC/SD/SDIO, SAI, SPI, SSI, SSP, UART
Package Tray
Product Status Active
Base Product Number MCIMX283
REACH Status REACH Unaffected
Standard Package 760
ECCN 5A992C
HTSUS 8542.31.0001

MCIMX283DVM4B i.MX28 applications processor 1 Core 32-Bit 454MHz 

The MCIMX283DVM4B is a high-performance, low-power applications processor from NXP Semiconductors (formerly Freescale), based on the ARM926EJ-S core running at up to 454 MHz and housed in a 289-pin MAPBGA package. It integrates 128 KB of on-chip SRAM, 128 KB of mask-programmable ROM, and supports a wide range of external memory interfaces including DDR2, LV-DDR2, and NAND Flash. The device operates over an industrial temperature range of −20 °C to +70 °C and is designed for embedded applications requiring rich connectivity, display support, and robust security features. With its integrated power management unit (PMU), multiple communication interfaces, and advanced security capabilities, the MCIMX283DVM4B is well-suited for industrial automation, consumer electronics, and automotive systems.

MCIMX283DVM4B Key Features

Key features include the ARM926EJ-S CPU with 16 KB instruction cache and 32 KB data cache, providing high processing performance for embedded applications. The device integrates 128 KB of low-power on-chip SRAM and 128 KB of mask-programmable ROM, along with 1280 bits of one-time-programmable (OCOTP) ROM for secure storage. Memory interfaces support 16-bit mobile DDR (mDDR), DDR2, and LV-DDR2 up to 205 MHz DDR clock frequency, with support for up to eight NAND flash devices and 20-bit BCH ECC. Communication interfaces include 10/100 Mbps Ethernet MAC with IEEE 1588 hardware timestamping, two CAN 2.0B interfaces, two USB 2.0 controllers (one OTG with PHY and one host with PHY), four synchronous serial ports (SSP) for SDIO/MMC/MS/SPI, five application UARTs, two I²C interfaces, and dual serial audio interfaces (SAIF). Display capabilities include an LCD controller supporting up to 24-bit RGB modes and a pixel-processing pipeline (PXP) for color-space conversion, scaling, alpha-blending, and rotation. Additional peripherals include eight pulse width modulators (PWM), a real-time clock (RTC), GPIO with interrupt capability, 16-channel low-resolution ADC (LRADC), 4/5-wire touchscreen controller, 8×8 keypad matrix, and a single-channel high-speed ADC (HSADC) with up to 2 Msps data rate. 

Alternative electronics processor Models

● MCIMX283CVM4B: A variant in the i.MX28 series with similar ARM926EJ-S core and peripherals, offering an alternative temperature grade and packaging option for applications with different environmental requirements.

● MCIMX286DVM4B: A higher-performance member of the i.MX28 family with enhanced features and similar pinout, providing increased processing capabilities while maintaining compatibility for more demanding applications.

● MCIMX6U5DVM10AB: An i.MX6 series applications processor with Cortex-A9 core, offering higher performance and advanced multimedia capabilities for applications requiring enhanced graphics and processing power.

● IMX53CEC: An i.MX53xD applications processor with advanced multimedia features and higher performance, suitable for applications requiring enhanced graphics and video processing capabilities.

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