NXP USA Inc. MPC8270ZQMIBA

MPC8270ZQMIBA


  • Manufacturer: NXP USA Inc.
  • CONEVO NO: MPC8270ZQMIBA
  • Package: 516-BBGA
  • Datasheet: PDF
  • Stock: In stock
  • Description: MPC8270ZQMIBA(Kg)

Details

Tags

Parameters
Security Features -
Mounting Type Surface Mount
Package / Case 516-BBGA
Supplier Device Package 516-PBGA (27x27)
Additional Interfaces I²C, SCC, SMC, SPI, UART, USART
Base Product Number MPC8270
RoHS Status RoHS non-compliant
Moisture Sensitivity Level (MSL) 3 (168 Hours)
REACH Status REACH Unaffected
ECCN 3A991A2
HTSUS 8542.31.0001
Other Names 935319177557
Standard Package 40
Mfr NXP USA Inc.
Series MPC82xx
Package Tray
Product Status Active
Core Processor PowerPC G2_LE
Number of Cores/Bus Width 1 Core, 32-Bit
Speed 333MHz
Co-Processors/DSP Communications; RISC CPM
RAM Controllers DRAM, SDRAM
Graphics Acceleration No
Display & Interface Controllers -
Ethernet 10/100Mbps (3)
SATA -
USB USB 2.0 (1)
Voltage - I/O 3.3V
Operating Temperature 0°C ~ 105°C (TA)
PowerPC G2_LE Microprocessor IC MPC82xx 1 Core, 32-Bit 333MHz 516-PBGA (27x27)
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