NXP USA Inc. MPC8313EVRAGDC

MPC8313EVRAGDC


  • Manufacturer: NXP USA Inc.
  • CONEVO NO: MPC8313EVRAGDC
  • Package: 516-BBGA Exposed Pad
  • Datasheet: PDF
  • Stock: In stock
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Details

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Parameters
REACH Status REACH Unaffected
ECCN 5A002A1 NXP
HTSUS 8542.31.0001
Standard Package 40
Mfr NXP USA Inc.
Series *
Package Tray
Product Status Active
Mounting Type Surface Mount
Package / Case 516-BBGA Exposed Pad
Supplier Device Package 516-TEPBGA (27x27)
Base Product Number MPC8313
RoHS Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Microprocessor IC * 516-TEPBGA (27x27)
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