NXP USA Inc. MPC8555EPXAPF557

MPC8555EPXAPF557


  • Manufacturer: NXP USA Inc.
  • CONEVO NO: MPC8555EPXAPF557
  • Package:
  • Datasheet: PDF
  • Stock: In stock
  • Description: MPC8555EPXAPF557(Kg)

Details

Tags

Parameters
Mfr NXP USA Inc.
Series *
Package Bulk
Product Status Active
RoHS Status Not applicable
Moisture Sensitivity Level (MSL) 3 (168 Hours)
REACH Status Vendor Undefined
ECCN 5A002A1
HTSUS 8542.31.0001
Standard Package 1
Microprocessor IC *
Contact Information
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