NXP USA Inc. MPC860DEZQ50D4

MPC860DEZQ50D4


  • Manufacturer: NXP USA Inc.
  • CONEVO NO: MPC860DEZQ50D4
  • Package: 357-BBGA
  • Datasheet: PDF
  • Stock: In stock
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ECCN 5A991B4B
HTSUS 8542.31.0001
Other Names 935316748557
Standard Package 44
Mfr NXP USA Inc.
Series MPC8xx
Package Tray
Product Status Obsolete
Core Processor MPC8xx
Number of Cores/Bus Width 1 Core, 32-Bit
Speed 50MHz
Co-Processors/DSP Communications; CPM
RAM Controllers DRAM
Graphics Acceleration No
Display & Interface Controllers -
Ethernet 10Mbps (2)
SATA -
USB -
Voltage - I/O 3.3V
Operating Temperature 0°C ~ 95°C (TA)
Security Features -
Mounting Type Surface Mount
Package / Case 357-BBGA
Supplier Device Package 357-PBGA (25x25)
Additional Interfaces I²C, IrDA, PCMCIA, SPI, TDM, UART/USART
Base Product Number MPC86
RoHS Status RoHS non-compliant
Moisture Sensitivity Level (MSL) 3 (168 Hours)
REACH Status REACH Unaffected
MPC8xx Microprocessor IC MPC8xx 1 Core, 32-Bit 50MHz 357-PBGA (25x25)
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