NXP USA Inc. MPC860SRVR50D4

MPC860SRVR50D4


  • Manufacturer: NXP USA Inc.
  • CONEVO NO: MPC860SRVR50D4
  • Package: 357-BBGA
  • Datasheet: PDF
  • Stock: In stock
  • Description: MPC860SRVR50D4(Kg)

Details

Tags

Parameters
Operating Temperature 0°C ~ 95°C (TA)
Security Features -
Mounting Type Surface Mount
Package / Case 357-BBGA
Supplier Device Package 357-PBGA (25x25)
Additional Interfaces HDLC/SDLC, I²C, IrDA, PCMCIA, SPI, TDM, UART/USART
Base Product Number MPC86
RoHS Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 3 (168 Hours)
REACH Status REACH Unaffected
ECCN 5A991B4B
HTSUS 8542.31.0001
Other Names 935324118557
Standard Package 44
Mfr NXP USA Inc.
Series MPC8xx
Package Tray
Product Status Obsolete
Core Processor MPC8xx
Number of Cores/Bus Width 1 Core, 32-Bit
Speed 50MHz
Co-Processors/DSP Communications; CPM
RAM Controllers DRAM
Graphics Acceleration No
Display & Interface Controllers -
Ethernet 10Mbps (4)
SATA -
USB -
Voltage - I/O 3.3V
MPC8xx Microprocessor IC MPC8xx 1 Core, 32-Bit 50MHz 357-PBGA (25x25)
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