NXP USA Inc. P89LPC931FDH,112

P89LPC931FDH,112


  • Manufacturer: NXP USA Inc.
  • CONEVO NO: P89LPC931FDH,112
  • Package: 28-TSSOP (0.173", 4.40mm Width)
  • Datasheet: PDF
  • Stock: In stock
  • Description: P89LPC931FDH,112(Kg)

Details

Tags

Parameters
Mfr NXP USA Inc.
Series LPC900
Package Tube
Product Status Obsolete
Core Processor 8051
Core Size 8-Bit
Speed 12MHz
Connectivity I²C, SPI, UART/USART
Peripherals Brown-out Detect/Reset, LED, POR, PWM, WDT
Number of I/O 26
Program Memory Size 8KB (8K x 8)
Program Memory Type FLASH
EEPROM Size -
RAM Size 256 x 8
Voltage - Supply (Vcc/Vdd) 2.4V ~ 3.6V
Data Converters -
Oscillator Type Internal
Operating Temperature -40°C ~ 85°C (TA)
Mounting Type Surface Mount
Package / Case 28-TSSOP (0.173", 4.40mm Width)
Supplier Device Package 28-TSSOP
Base Product Number P89LPC931
RoHS Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 1 (Unlimited)
REACH Status REACH Unaffected
ECCN EAR99
HTSUS 8542.31.0001
Standard Package 51
8051 LPC900 Microcontroller IC 8-Bit 12MHz 8KB (8K x 8) FLASH 28-TSSOP
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