NXP USA Inc. S9S08QD4J1MSCR

S9S08QD4J1MSCR


  • Manufacturer: NXP USA Inc.
  • CONEVO NO: S9S08QD4J1MSCR
  • Package: 8-SOIC (0.154", 3.90mm Width)
  • Datasheet: PDF
  • Stock: In stock
  • Description: S9S08QD4J1MSCR(Kg)

Details

Tags

Parameters
Mfr NXP USA Inc.
Series S08
Package Tape & Reel (TR)
Product Status Active
Core Processor S08
Core Size 8-Bit
Speed 16MHz
Connectivity -
Peripherals LVD, POR, PWM, WDT
Number of I/O 4
Program Memory Size 4KB (4K x 8)
Program Memory Type FLASH
EEPROM Size -
RAM Size 256 x 8
Voltage - Supply (Vcc/Vdd) 2.7V ~ 5.5V
Data Converters A/D 4x10b
Oscillator Type Internal
Operating Temperature -40°C ~ 125°C (TA)
Mounting Type Surface Mount
Package / Case 8-SOIC (0.154", 3.90mm Width)
Supplier Device Package 8-SOIC
Base Product Number S9S08
RoHS Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 3 (168 Hours)
REACH Status REACH Unaffected
ECCN 3A991A2
HTSUS 8542.31.0001
Standard Package 2,500
S08 S08 Microcontroller IC 8-Bit 16MHz 4KB (4K x 8) FLASH 8-SOIC
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