NXP USA Inc. S9S12GN32BMTJ

S9S12GN32BMTJ


  • Manufacturer: NXP USA Inc.
  • CONEVO NO: S9S12GN32BMTJ
  • Package: 20-TSSOP (0.173", 4.40mm Width)
  • Datasheet: PDF
  • Stock: In stock
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Mfr NXP USA Inc.
Series HCS12
Package Tube
Product Status Active
Core Processor 12V1
Core Size 16-Bit
Speed 25MHz
Connectivity IrDA, LINbus, SCI, SPI
Peripherals LVD, POR, PWM, WDT
Number of I/O 14
Program Memory Size 32KB (32K x 8)
Program Memory Type FLASH
EEPROM Size 1K x 8
RAM Size 2K x 8
Voltage - Supply (Vcc/Vdd) 3.13V ~ 5.5V
Data Converters A/D 8x10b
Oscillator Type Internal
Operating Temperature -40°C ~ 125°C (TA)
Mounting Type Surface Mount
Package / Case 20-TSSOP (0.173", 4.40mm Width)
Supplier Device Package 20-TSSOP
Base Product Number S9S12
RoHS Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 3 (168 Hours)
REACH Status REACH Unaffected
ECCN 3A991A2
HTSUS 8542.31.0001
Other Names 935362337574
Standard Package 75
12V1 HCS12 Microcontroller IC 16-Bit 25MHz 32KB (32K x 8) FLASH 20-TSSOP
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