NXP USA Inc. SSTU32865ET/G,551

SSTU32865ET/G,551


  • Manufacturer: NXP USA Inc.
  • CONEVO NO: SSTU32865ET/G,551
  • Package: 160-TFBGA
  • Datasheet: PDF
  • Stock: In stock
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Details

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Parameters
ECCN EAR99
HTSUS 8542.39.0001
Standard Package 119
Mfr NXP USA Inc.
Series -
Package Tray
Product Status Obsolete
Logic Type 1:2 Registered Buffer with Parity
Supply Voltage 1.7V ~ 1.9V
Number of Bits 28
Operating Temperature 0°C ~ 70°C
Mounting Type Surface Mount
Package / Case 160-TFBGA
Supplier Device Package 160-TFBGA (13x9)
Base Product Number SSTU32865
RoHS Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 3 (168 Hours)
REACH Status REACH Unaffected
1:2 Registered Buffer with Parity IC 160-TFBGA (13x9)
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