Renesas Electronics America Inc R8A774C0HA01BG#U0
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| Parameters | |
|---|---|
| Supplier Device Package | 552-FBGA (21x21) |
| Additional Interfaces | CAN, I²C, MMC/SD/SDIO, SCI, SCI FIFO, SPDIF, SPI, SSI |
| RoHS Status | ROHS3 Compliant |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| REACH Status | REACH Unaffected |
| Other Names | 559-R8A774C0HA01BG#U0 |
| Standard Package | 300 |
| Mfr | Renesas Electronics America Inc |
| Series | RZ/G2E |
| Package | Tray |
| Product Status | Discontinued at Digi-Key |
| Core Processor | ARM® Cortex®-A53 |
| Number of Cores/Bus Width | 2 Core, 64-Bit |
| Speed | 1.2GHz |
| Co-Processors/DSP | Multimedia; NEON™ MPE |
| RAM Controllers | DDR3L |
| Graphics Acceleration | No |
| Display & Interface Controllers | MIPI-CSI |
| Ethernet | 10/100Mbps (1), 100/1000Mbps (1) |
| SATA | - |
| USB | USB 2.0 (1), USB 3.0 (1) |
| Voltage - I/O | - |
| Operating Temperature | -40°C ~ 85°C (TA) |
| Security Features | - |
| Mounting Type | Surface Mount |
| Package / Case | 552-FBGA |
ARM® Cortex®-A53 Microprocessor IC RZ/G2E 2 Core, 64-Bit 1.2GHz 552-FBGA (21x21)
