Renesas Electronics America Inc UPD70F3382M2GJA-GAE-AX

UPD70F3382M2GJA-GAE-AX


  • Manufacturer: Renesas Electronics America Inc
  • CONEVO NO: UPD70F3382M2GJA-GAE-AX
  • Package: 144-LQFP
  • Datasheet: PDF
  • Stock: In stock
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ECCN 3A991A2
HTSUS 8542.31.0001
Standard Package 60
Mfr Renesas Electronics America Inc
Series Automotive, AEC-Q100, V850ES/Fx3
Package Tray
Product Status Not For New Designs
Core Processor V850ES
Core Size 32-Bit Single-Core
Speed 32MHz
Connectivity CANbus, CSI, EBI/EMI, I²C, LINbus, UART/USART
Peripherals DMA, LVD, POR, PWM, WDT
Number of I/O 128
Program Memory Size 1MB (1M x 8)
Program Memory Type FLASH
EEPROM Size -
RAM Size 48K x 8
Voltage - Supply (Vcc/Vdd) 3.3V ~ 5.5V
Data Converters A/D 24x10b
Oscillator Type Internal
Operating Temperature -40°C ~ 85°C (TA)
Mounting Type Surface Mount
Package / Case 144-LQFP
Supplier Device Package 144-LQFP (20x20)
Base Product Number UPD70F3382
RoHS Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 3 (168 Hours)
REACH Status REACH Unaffected
V850ES Automotive, AEC-Q100, V850ES/Fx3 Microcontroller IC 32-Bit Single-Core 32MHz 1MB (1M x 8) FLASH 144-LQFP (20x20)
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