TAS5508BPAGRG4

This MCU is built using the high-performance silicon gate CMOS process using the R8C CPU core and is packaged

in a 48-pin plastic molded LQFP. This MCU operates using sophisticated instructions featuring a high level of

instruction efficiency. With 1 Mbyte of address space, it is capable of executing instructions at high speed. This MCU

is equipped with one CAN module and suited to in-vehicle or FA networking.

Furthermore, the data flash (1 KB x 2 blocks) is embedded in the R8C/23 Group.

The difference between R8C/22 and R8C/23 Groups is only the existence of the data flash. Their peripheral functions

are the same.

1.1 Applications

Automotive, etc

1.2 Performance Overview

Table 1.1 outlines the Functions and Specifications for R8C/22 Group and Table 1.2 outlines the Functions and

Specifications for R8C/23 Group.