W29N01HVSINA

W29N01HVSINA


  • Manufacturer: Winbond Electronics
  • CONEVO NO: W29N01HVSINA
  • Package: 48-TFSOP (0.724", 18.40mm Width)
  • Datasheet: PDF
  • Stock: In stock
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Tags

Parameters
Series -
Moisture Sensitivity Level (MSL) 3 (168 Hours)
RoHS Status ROHS3 Compliant
Package / Case 48-TFSOP (0.724", 18.40mm Width)
Mfr Winbond Electronics
Mounting Type Surface Mount
Operating Temperature -40°C ~ 85°C (TA)
Technology FLASH - NAND (SLC)
Supplier Device Package 48-TSOP
Access Time 25 ns
Memory Size 1Gbit
Memory Type Non-Volatile
Voltage - Supply 2.7V ~ 3.6V
Memory Organization 128M x 8
Memory Format FLASH
Memory Interface Parallel
Write Cycle Time - Word, Page 25ns
Package Tray
Product Status Active
Base Product Number W29N01
REACH Status REACH Unaffected
Standard Package 96
ECCN 3A991B1A
HTSUS 8542.32.0071

W29N01HVSINA SLC NAND flash memory IC 1Gbit Parallel 25 ns 48-TSOP

The W29N01HVSINA is a 1G-bit (128M × 8) SLC NAND flash memory from Winbond Electronics, housed in a 48-pin TSOP package and designed for high-performance data storage in embedded systems. It operates from a single 2.7 V to 3.6 V supply with a maximum active current of 35 mA and supports the standard NAND flash interface with an 8-bit multiplexed I/O bus for data, address, and command transfer. The memory chip features a page size of 2,112 bytes (2,048 + 64 bytes) and a block size of 64 pages (128K + 4K bytes), with an industrial temperature range of −40 °C to +85 °C, making it suitable for a wide range of consumer, industrial, and automotive applications.

Key features include single-level cell (SLC) NAND technology for high reliability and endurance, a 1G-bit density in a single chip, and a standard NAND interface with CLE, ALE, CE, RE, and WE control signals for easy integration with microcontrollers and SoCs. The device supports page read, page program, copy-back, block erase, and reset operations, along with write protect (WP) and ready/busy (RY/BY) status monitoring for robust system-level protection. Electrical characteristics include a typical standby current of 10 µA, enabling low-power operation in battery-powered systems, and built-in ECC support for error detection and correction in data-intensive applications.

Alternative SLC NAND memory Models

● W29N02GVSIAA: 2G-bit SLC NAND flash from Winbond with similar 3.3 V operation and NAND interface, offering higher density for applications requiring more storage capacity.

● MX30LF1G08AA-XKI: 1G-bit NAND flash from Macronix with 3.3 V operation and standard NAND interface, providing an alternative SLC solution for code and data storage.

● MT29F1G08AB: 1G-bit NAND flash from Micron Technology with comparable density and performance, suitable for consumer and industrial data storage applications.

● K9WAG08U1M: 1G x 8 / 2G x 8 bit NAND flash from Samsung with high-speed data transfer and SLC technology, ideal for performance-critical storage systems.

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