XCS40-3PQ208I

Introducing the XCS40-3PQ208I, the latest addition to our line of high-performance products. Designed with cutting-edge technology and precision craftsmanship, this product is set to revolutionize the industry. The XCS40-3PQ208I boasts an impressive range of features that will enhance your productivity and efficiency. With its powerful quad-core processor, it delivers lightning-fast performance, allowing you to tackle even the most demanding tasks with ease. Its advanced graphics capabilities ensure stunning visuals and unrivaled clarity, taking your multimedia experience to new heights. Equipped with ample storage space, this product offers the perfect solution for all your data needs. Whether you are a business professional or a tech-savvy gamer, you can rely on the XCS40-3PQ208I to store and access all your files with utmost speed and convenience. In addition, this product offers seamless connectivity options, enabling you to easily connect with external devices and networks. Its sleek and modern design adds a touch of elegance to any workspace, making it a stylish choice for both professional and personal use. Experience the XCS40-3PQ208I and unlock a world of possibilities. Upgrade your technology with this exceptional product and elevate your performance to new heights.

banner

Other Products

View More
  • 1664-1648-ND

    1664-1648-ND

  • 1664-1621-ND

    1664-1621-ND

  • 492-1040-ND

    492-1040-ND

  • 471-025-ND

    471-025-ND

  • 535-10135-ND

    535-10135-ND

  • 576-4757-ND

    576-4757-ND

  • 492-1737-ND

    492-1737-ND

  • 492-1736-ND

    492-1736-ND

  • 1664-1652-ND

    1664-1652-ND

  • 535-10105-ND

    535-10105-ND

  • 1437503-7-ND

    1437503-7-ND

  • 1664-1602-ND

    1664-1602-ND

Related Blogs

  • 2025 / 10 / 15

    OpenAI's Hardware Collaboration Strategy: Building a Robust Computing Power Ecosystem

    OpenAI has recently announced three major hardware collaborations with Broadcom, AMD, and NVIDIA, aiming to deploy a total of 26 gigawatts of computing power. ...

    OpenAI's Hardware Collaboration Strategy: Building a Robust Computing Power Ecosystem
  • 2025 / 10 / 14

    Popular IC Components in Recent Times: Performance and Alternatives

    Explores popular IC components known for their exceptional performance and broad applications, like ISO1050DUBR, ADR421ARMZ, XCZU47DR-2FFVE1156I, PCF8563TS/5,118, and STM32G030F6P6TR......

    Popular IC Components in Recent Times: Performance and Alternatives
  • 2025 / 10 / 13

    Wingtech's $14.7B yuan Semiconductor Assets Frozen by Netherlands: Full Story

    On October 12, 2025, Wingtech Technology announced that the Dutch government had frozen assets of its wholly-owned subsidiary Nexperia, valued at 14.7 billion yuan....

    Wingtech's $14.7B yuan Semiconductor Assets Frozen by Netherlands: Full Story
  • 2025 / 10 / 11

    What Is a Voltage-Level Translator?

    Voltage-level translators, also known as level shifters, are crucial for enabling communication between electronic devices operating at different voltage levels. They prevent signal distortion and equipment damage by converting signal voltages accurately. ...

    What Is a Voltage-Level Translator?
  • 2025 / 10 / 10

    NVIDIA Adds Orders for 800G Optical Modules: The Future of Data Centers

    NVIDIA has significantly increased its orders for 800G optical modules for 2026, with a 35% rise in demand. The growing need for high-speed optical modules in data centers, driven by AI, highlights the importance of 800G modules....

    NVIDIA Adds Orders for 800G Optical Modules: The Future of Data Centers
  • 2025 / 10 / 09

    Accelerating Innovation: Altera Expands Its Agilex™ FPGA Portfolio

    Altera is expanding its Agilex™ FPGA portfolio with new hardware and software solutions. The Agilex 5 and Agilex 3 SoC FPGAs are now in mass production, offering low latency and high integration for edge AI and co-processing applications. ...

    Accelerating Innovation: Altera Expands Its Agilex™ FPGA Portfolio
  • 2025 / 09 / 30

    STMicroelectronics' Tour PLP Pilot Line Targets Q3 2026 Kick-Off

    ST brings next-gen Panel-Level Packaging to Tours: $60M pilot line starts Q3-2026, boosting throughput and cutting cost....

    STMicroelectronics' Tour PLP Pilot Line Targets Q3 2026 Kick-Off
  • 2025 / 09 / 29

    ARM Tech's STAR-MC3: Powering Up MCU AI with Innovation

    ARM Technology has launched the third-generation high-energy-efficient embedded chip IP, "Stellar" STAR-MC3, significantly enhancing MCU AI processing capabilities. ...

    ARM Tech's STAR-MC3: Powering Up MCU AI with Innovation
  • 2025 / 09 / 28

    AMD's DDR5 Innovation: HB-DIMM for Next-Level Performance

    AMD's new patent for High Bandwidth Dual In-line Memory Module (HB-DIMM) represents a significant leap in DDR5 memory technology. ...

    AMD's DDR5 Innovation: HB-DIMM for Next-Level Performance
  • 2025 / 09 / 26

    Micron Samples the Industry's Fastest HBM4 Product: Tech Breakthrough and Market Outlook

    Micron Technology has made a significant breakthrough in the HBM field by shipping the industry's fastest 11 Gbps HBM4 samples....

    Micron Samples the Industry's Fastest HBM4 Product: Tech Breakthrough and Market Outlook
Contact Information
close