AD7895BR-2

Introducing the AD7895BR-2, a high-performance analog-to-digital converter designed to deliver precision and accuracy in your data acquisition applications. Whether you are working in industrial automation, telecommunications, or automotive systems, this cutting-edge ADC module is engineered to meet the highest standards of performance. The AD7895BR-2 boasts a 16-bit resolution, allowing for precise measurement and conversion of analog signals to digital data. With a maximum sampling rate of 250 kilosamples per second, even the most demanding applications can be accurately captured in real-time. Additionally, this ADC module features a wide input voltage range of ±10V, ensuring compatibility with a variety of signal sources. Equipped with a built-in reference voltage and sample-and-hold circuitry, the AD7895BR-2 guarantees exceptional linearity and low distortion, resulting in superior signal integrity. The small form factor and low power consumption also make it suitable for space-constrained applications without compromising its performance. With its outstanding features, the AD7895BR-2 is poised to revolutionize the way you acquire and process analog signals. Experience the power of precision with our state-of-the-art ADC module.

banner

Other Products

View More
  • 1993-XEJPL5372NE-ND

    1993-XEJPL5372NE-ND

  • H-115P-ND

    H-115P-ND

  • 1625895-5-ND

    1625895-5-ND

  • 716-ACCPOTECB303430400-ND

    716-ACCPOTECB303430400-ND

  • 716-ACCPOTERB253653190-ND

    716-ACCPOTERB253653190-ND

  • H-58P-ND

    H-58P-ND

  • 1993-JPEPL6052INI-ND

    1993-JPEPL6052INI-ND

  • 1993-XEJPL5220NE-ND

    1993-XEJPL5220NE-ND

  • 1993-JPEPL5214NE-ND

    1993-JPEPL5214NE-ND

  • 1993-JPEPL5012GR-ND

    1993-JPEPL5012GR-ND

  • 716-ACCPOTJOB303753950-ND

    716-ACCPOTJOB303753950-ND

  • H-83P-ND

    H-83P-ND

Related Blogs

  • 2026 / 08 / 20

    Marvell and Google Forge Strategic Partnership in Custom Product

    Google diversifies its AI chip strategy via a custom semiconductor partnership with Marvell, spanning inference accelerators and networking silicon ...

    Marvell and Google Forge Strategic Partnership in Custom Product
  • 2026 / 08 / 19

    Supply Chain Cost Pressures Mount, ST Third Price Hike of 2026

    ST issues third 2026 price hike, with product lines rising August 23. Barely four months since the last adjustment....

    Supply Chain Cost Pressures Mount, ST Third Price Hike of 2026
  • 2026 / 08 / 18

    Amkor Plans Spin-off of China Packaging and Testing Business

    Amkor plans to spin off its China packaging unit, selling a majority stake valued at $1–1.5B. It Still in early stages....

    Amkor Plans Spin-off of China Packaging and Testing Business
  • 2026 / 08 / 17

    Accelerated Exit: Nokia to Close Hangzhou R&D Center

    Nokia accelerates its China exit with the closure of its Hangzhou R&D center, cutting 1,600 jobs. ...

    Accelerated Exit: Nokia to Close Hangzhou R&D Center
  • 2026 / 08 / 13

    IBM and Together AI Sign $240 Million Agreement

    IBM and Together AI ink a $240M deal to deploy a NVIDIA Blackwell-powered open-source AI inference cluster on IBM Cloud....

    IBM and Together AI Sign $240 Million Agreement
  • 2026 / 08 / 12

    Intel Raises $15 Billion to Accelerate Chip Manufacturing

    Intel raises $15B for AI silicon and manufacturing. It targets 18A/14A nodes, advanced packaging, and foundry growth....

    Intel Raises $15 Billion to Accelerate Chip Manufacturing
  • 2026 / 08 / 11

    Teledyne to Acquire Varex Imaging for $1.1 Billion

    Teledyne's $1.1 billion acquisition of Varex Imaging unites complementary X-ray technologies, strengthening its healthcare position....

    Teledyne to Acquire Varex Imaging for $1.1 Billion
  • 2026 / 08 / 10

    SK Hynix Invests 54 Trillion Won to Expand Yongin Y2 and Cheongju M17 Fabs

    SK Hynix commits 54 trillion won to build Yongin Y2 and Cheongju M17 fabs. The investment targets HBM and NAND to meet soaring AI demand....

    SK Hynix Invests 54 Trillion Won to Expand Yongin Y2 and Cheongju M17 Fabs
  • 2026 / 08 / 07

    TI TPSM Series Power Modules – Selection Guide

    TI TPSM modules integrate controller, MOSFETs, inductor, and passives in a single package. ust add caps – no loop design. Ideal for industrial, auto, telecom....

    TI TPSM Series Power Modules – Selection Guide
  • 2026 / 08 / 06

    All Three Major DRAM Manufacturers' 2027 Capacity Fully Sold Out

    Ccrisis intensifies: 2027 all DRAM/HBM capacity sold out by top 3 makers. AI GPU demand surges, NAND tightens through 2028....

    All Three Major DRAM Manufacturers' 2027 Capacity Fully Sold Out
Contact Information
close