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2025 / 10 / 29
Analysis of Popular IC Components Features, Applications, and Alternatives
An in-depth analysis of several popular IC models, including NC7SZ32M5X, EPM570GF100I5N, TPA6205A1DRBR, MCP121T-300E, and XC17S05XLPD8I. It covers their key features, application scenarios, and similar models from other suppliers....
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2025 / 10 / 28
MediaTek Secures $1 Billion AI Chip Order from Google, with 2026 Launch
MediaTek has secured a $1 billion order from Google to develop custom AI chips. The collaboration involves creating TPU v7 chips using TSMC's 3nm process, with mass production set for Q4 2026. ...
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2025 / 10 / 27
Keysight Technologies Completes Acquisition of Spirent Communications for £1.16 Billion
Keysight completed its acquisition of Spirent Communications for £1.16 billion in October 2025. The acquisition aims to expand Keysight's communication test capabilities and enhance competitiveness in emerging tech areas....
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2025 / 10 / 24
Applied Materials Announces 4% Global Layoffs, Affecting Over 1,400 Employees
On October 23, 2025, US chip equipment maker Applied Materials announced a global layoff plan, cutting 4% of its workforce, affecting about 1,444 employees. ...
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2025 / 10 / 23
18A Process Breakthrough: Intel to Manufacture Microsoft's AI Chip Maia 2
Intel has secured a significant order from Microsoft to manufacture the next-generation AI accelerator, Maia 2, using its advanced 18A process. ...
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2025 / 10 / 22
ADI Sells Penang Plant to ASE: A Win-Win Deal
On October 21, 2025, ASE and ADI signed a binding MOU in Penang, Malaysia, for ASE to acquire ADI's Penang facility. Established in 1994, the facility spans over 680,000 sq ft....
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2025 / 10 / 21
Yageo's JPY 109 Billion Acquisition of Shibaura Electronics
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2025 / 10 / 20
Microsoft Plans to Relocate Surface Production Lines from China
Microsoft is reportedly planning to relocate its Surface production lines from China, with the entire process, including components and final assembly, expected to move by 2026. ...
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2025 / 10 / 17
Oracle Bet: 50,000 AMD Chips for AI Supercluster
Oracle plans to deploy 50,000 AMD Instinct MI450 AI chips starting Q3 2026 to build a public AI supercluster. It also the key infrastructure support for Oracle's $300 billion collaboration with OpenAI....
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2025 / 10 / 16
Samsung's Memory Innovations: HBM4E and LPDDR6 Lead
Samsung Electronics is making significant strides in memory technology. It aims to achieve over 3TB/s bandwidth with its seventh-generation HBM4E by 2027, a 2.5x improvement over current HBM3E......