AD8182ARZ

Introducing the AD8182ARZ, an advanced dual 10 Gbps differential receiver from Analog Devices Inc. Designed with utmost precision, this high-performance product is built to meet the increasing demand for efficient communication systems. The AD8182ARZ is specifically engineered to amplify low voltage differential signals, making it an essential component in data transmission applications. With a wide bandwidth ranging from DC to 3 GHz, this receiver guarantees exceptional signal integrity and fidelity, enabling faster data transfers and reliable connectivity. Equipped with an industry-leading power dissipation feature, the AD8182ARZ operates efficiently in high-temperature environments, ensuring optimum performance in any operating condition. Additionally, its superior noise and distortion characteristics enhance the overall quality of the received signal, reducing noise interference and enhancing data accuracy. The AD8182ARZ is user-friendly and can be easily integrated into various communication systems. It is available in a small form factor package, enabling easy mounting on printed circuit boards, saving space, and facilitating hassle-free assembly. Whether you are working on next-generation telecommunications, automotive systems, or high-speed data links, the AD8182ARZ is the perfect solution for your differential receiver needs. Trust Analog Devices Inc. to provide you with cutting-edge technology that excels in the face of challenging applications, delivering superior performance every time.

banner

Other Products

View More
  • VFD2041-E-ND

    VFD2041-E-ND

  • 286-1081-ND

    286-1081-ND

  • C-20-0503F-ND

    C-20-0503F-ND

  • M0220MD-202MDAR1-3-ND

    M0220MD-202MDAR1-3-ND

  • 286-1020-ND

    286-1020-ND

  • 286-1088-ND

    286-1088-ND

  • 286-1089-ND

    286-1089-ND

  • D0420SD-53-4001FN-ND

    D0420SD-53-4001FN-ND

  • D0106LT-43-0601-ND

    D0106LT-43-0601-ND

  • GU256X64D-7000BX-ND

    GU256X64D-7000BX-ND

  • 286-1064-ND

    286-1064-ND

  • 286-AH1616CF-ND

    286-AH1616CF-ND

Related Blogs

  • 2026 / 08 / 20

    Marvell and Google Forge Strategic Partnership in Custom Product

    Google diversifies its AI chip strategy via a custom semiconductor partnership with Marvell, spanning inference accelerators and networking silicon ...

    Marvell and Google Forge Strategic Partnership in Custom Product
  • 2026 / 08 / 19

    Supply Chain Cost Pressures Mount, ST Third Price Hike of 2026

    ST issues third 2026 price hike, with product lines rising August 23. Barely four months since the last adjustment....

    Supply Chain Cost Pressures Mount, ST Third Price Hike of 2026
  • 2026 / 08 / 18

    Amkor Plans Spin-off of China Packaging and Testing Business

    Amkor plans to spin off its China packaging unit, selling a majority stake valued at $1–1.5B. It Still in early stages....

    Amkor Plans Spin-off of China Packaging and Testing Business
  • 2026 / 08 / 17

    Accelerated Exit: Nokia to Close Hangzhou R&D Center

    Nokia accelerates its China exit with the closure of its Hangzhou R&D center, cutting 1,600 jobs. ...

    Accelerated Exit: Nokia to Close Hangzhou R&D Center
  • 2026 / 08 / 13

    IBM and Together AI Sign $240 Million Agreement

    IBM and Together AI ink a $240M deal to deploy a NVIDIA Blackwell-powered open-source AI inference cluster on IBM Cloud....

    IBM and Together AI Sign $240 Million Agreement
  • 2026 / 08 / 12

    Intel Raises $15 Billion to Accelerate Chip Manufacturing

    Intel raises $15B for AI silicon and manufacturing. It targets 18A/14A nodes, advanced packaging, and foundry growth....

    Intel Raises $15 Billion to Accelerate Chip Manufacturing
  • 2026 / 08 / 11

    Teledyne to Acquire Varex Imaging for $1.1 Billion

    Teledyne's $1.1 billion acquisition of Varex Imaging unites complementary X-ray technologies, strengthening its healthcare position....

    Teledyne to Acquire Varex Imaging for $1.1 Billion
  • 2026 / 08 / 10

    SK Hynix Invests 54 Trillion Won to Expand Yongin Y2 and Cheongju M17 Fabs

    SK Hynix commits 54 trillion won to build Yongin Y2 and Cheongju M17 fabs. The investment targets HBM and NAND to meet soaring AI demand....

    SK Hynix Invests 54 Trillion Won to Expand Yongin Y2 and Cheongju M17 Fabs
  • 2026 / 08 / 07

    TI TPSM Series Power Modules – Selection Guide

    TI TPSM modules integrate controller, MOSFETs, inductor, and passives in a single package. ust add caps – no loop design. Ideal for industrial, auto, telecom....

    TI TPSM Series Power Modules – Selection Guide
  • 2026 / 08 / 06

    All Three Major DRAM Manufacturers' 2027 Capacity Fully Sold Out

    Ccrisis intensifies: 2027 all DRAM/HBM capacity sold out by top 3 makers. AI GPU demand surges, NAND tightens through 2028....

    All Three Major DRAM Manufacturers' 2027 Capacity Fully Sold Out
Contact Information
close