AOZ1212DIL

Introducing the AOZ1212DIL, the perfect solution to all your power management needs! Designed to deliver high efficiency and unrivaled performance, this advanced power management IC is a game-changer in the industry. The AOZ1212DIL offers a wide input voltage range of 2.7V to 18V, making it suitable for a wide variety of applications, from industrial to consumer electronics. With a low RDS(ON) of 14mΩ, it boasts a highly efficient power conversion, resulting in reduced power loss and increased system reliability. Equipped with a built-in overvoltage protection, undervoltage lockout, and thermal shut down, this power management IC ensures superior safety for your system. It also features a soft-start function that minimizes inrush current during start-up, preventing any potential damage to the internal components. The AOZ1212DIL is housed in a compact DFN package, saving valuable board space and simplifying the integration process. With its industry-leading features and exceptional reliability, this power management IC is the ideal choice for engineers and designers seeking optimum power performance. Whether you're working on industrial automation, telecommunications, or consumer electronics, trust the AOZ1212DIL to deliver outstanding power management capabilities that set your products apart.

banner

Other Products

View More
  • V850-2368-900-ND

    V850-2368-900-ND

  • 516-3523-ND

    516-3523-ND

  • 20500001111-ND

    20500001111-ND

  • HFM5500-BBM-ND

    HFM5500-BBM-ND

  • FB135-ND

    FB135-ND

  • 516-2302-5-ND

    516-2302-5-ND

  • OPF397D-ND

    OPF397D-ND

  • V850-2225-001-ND

    V850-2225-001-ND

  • LNA4501FV-ND

    LNA4501FV-ND

  • AFBR-812RN1Z-ND

    AFBR-812RN1Z-ND

  • FB129-ND

    FB129-ND

  • AFBR-811FH3Z-ND

    AFBR-811FH3Z-ND

Related Blogs

  • 2026 / 08 / 20

    Marvell and Google Forge Strategic Partnership in Custom Product

    Google diversifies its AI chip strategy via a custom semiconductor partnership with Marvell, spanning inference accelerators and networking silicon ...

    Marvell and Google Forge Strategic Partnership in Custom Product
  • 2026 / 08 / 19

    Supply Chain Cost Pressures Mount, ST Third Price Hike of 2026

    ST issues third 2026 price hike, with product lines rising August 23. Barely four months since the last adjustment....

    Supply Chain Cost Pressures Mount, ST Third Price Hike of 2026
  • 2026 / 08 / 18

    Amkor Plans Spin-off of China Packaging and Testing Business

    Amkor plans to spin off its China packaging unit, selling a majority stake valued at $1–1.5B. It Still in early stages....

    Amkor Plans Spin-off of China Packaging and Testing Business
  • 2026 / 08 / 17

    Accelerated Exit: Nokia to Close Hangzhou R&D Center

    Nokia accelerates its China exit with the closure of its Hangzhou R&D center, cutting 1,600 jobs. ...

    Accelerated Exit: Nokia to Close Hangzhou R&D Center
  • 2026 / 08 / 13

    IBM and Together AI Sign $240 Million Agreement

    IBM and Together AI ink a $240M deal to deploy a NVIDIA Blackwell-powered open-source AI inference cluster on IBM Cloud....

    IBM and Together AI Sign $240 Million Agreement
  • 2026 / 08 / 12

    Intel Raises $15 Billion to Accelerate Chip Manufacturing

    Intel raises $15B for AI silicon and manufacturing. It targets 18A/14A nodes, advanced packaging, and foundry growth....

    Intel Raises $15 Billion to Accelerate Chip Manufacturing
  • 2026 / 08 / 11

    Teledyne to Acquire Varex Imaging for $1.1 Billion

    Teledyne's $1.1 billion acquisition of Varex Imaging unites complementary X-ray technologies, strengthening its healthcare position....

    Teledyne to Acquire Varex Imaging for $1.1 Billion
  • 2026 / 08 / 10

    SK Hynix Invests 54 Trillion Won to Expand Yongin Y2 and Cheongju M17 Fabs

    SK Hynix commits 54 trillion won to build Yongin Y2 and Cheongju M17 fabs. The investment targets HBM and NAND to meet soaring AI demand....

    SK Hynix Invests 54 Trillion Won to Expand Yongin Y2 and Cheongju M17 Fabs
  • 2026 / 08 / 07

    TI TPSM Series Power Modules – Selection Guide

    TI TPSM modules integrate controller, MOSFETs, inductor, and passives in a single package. ust add caps – no loop design. Ideal for industrial, auto, telecom....

    TI TPSM Series Power Modules – Selection Guide
  • 2026 / 08 / 06

    All Three Major DRAM Manufacturers' 2027 Capacity Fully Sold Out

    Ccrisis intensifies: 2027 all DRAM/HBM capacity sold out by top 3 makers. AI GPU demand surges, NAND tightens through 2028....

    All Three Major DRAM Manufacturers' 2027 Capacity Fully Sold Out
Contact Information
close