AOZ1361DI-01

Introducing the AOZ1361DI-01, the latest breakthrough in power management solutions. This advanced product redefines efficiency and performance, offering unmatched capabilities for a wide range of applications. Boasting cutting-edge technology, the AOZ1361DI-01 delivers remarkable power conversion efficiency, enabling consumers to optimize power usage and reduce energy costs. With its dynamic voltage scaling feature, this product ensures maximum power savings while maintaining stable output voltage for critical devices. Designed with versatility in mind, the AOZ1361DI-01 is compatible with various input voltage ranges, making it suitable for a multitude of consumer electronics, industrial, and automotive applications. Its small form factor and low profile design allow for seamless integration into space-constrained designs. Furthermore, this power management solution prioritizes safety, offering comprehensive protection features such as overvoltage, overcurrent, and over-temperature protection, ensuring the longevity of devices and safeguarding against potential damage. The AOZ1361DI-01 sets a new benchmark in power management technology, delivering unrivaled performance, efficiency, and reliability for modern power-hungry devices. Upgrade to the AOZ1361DI-01 and experience a new level of power management efficiency.

banner

Other Products

View More
  • onsemi FSFR2100XSL

    onsemi FSFR2100XSL

  • onsemi NCP1055P100

    onsemi NCP1055P100

  • Monolithic Power Systems Inc. HR1001CGS-Z

    Monolithic Power Systems Inc. HR1001CGS-Z

  • Rohm Semiconductor BM1Q002FJ-E2

    Rohm Semiconductor BM1Q002FJ-E2

  • STMicroelectronics VIPER011XS

    STMicroelectronics VIPER011XS

  • onsemi NCP12400CBHAA0DR2G

    onsemi NCP12400CBHAA0DR2G

  • Sanken STR-X6769B

    Sanken STR-X6769B

  • onsemi FSDM0465RSWDTU

    onsemi FSDM0465RSWDTU

  • Fairchild Semiconductor FSQ0465RWDTU

    Fairchild Semiconductor FSQ0465RWDTU

  • onsemi NCP1077BAP065G

    onsemi NCP1077BAP065G

  • Texas Instruments UCC3809P-1

    Texas Instruments UCC3809P-1

  • Texas Instruments UCC25701NG4

    Texas Instruments UCC25701NG4

Related Blogs

  • 2026 / 08 / 19

    Supply Chain Cost Pressures Mount, ST Third Price Hike of 2026

    ST issues third 2026 price hike, with product lines rising August 23. Barely four months since the last adjustment....

    Supply Chain Cost Pressures Mount, ST Third Price Hike of 2026
  • 2026 / 08 / 18

    Amkor Plans Spin-off of China Packaging and Testing Business

    Amkor plans to spin off its China packaging unit, selling a majority stake valued at $1–1.5B. It Still in early stages....

    Amkor Plans Spin-off of China Packaging and Testing Business
  • 2026 / 08 / 17

    Accelerated Exit: Nokia to Close Hangzhou R&D Center

    Nokia accelerates its China exit with the closure of its Hangzhou R&D center, cutting 1,600 jobs. ...

    Accelerated Exit: Nokia to Close Hangzhou R&D Center
  • 2026 / 08 / 13

    IBM and Together AI Sign $240 Million Agreement

    IBM and Together AI ink a $240M deal to deploy a NVIDIA Blackwell-powered open-source AI inference cluster on IBM Cloud....

    IBM and Together AI Sign $240 Million Agreement
  • 2026 / 08 / 12

    Intel Raises $15 Billion to Accelerate Chip Manufacturing

    Intel raises $15B for AI silicon and manufacturing. It targets 18A/14A nodes, advanced packaging, and foundry growth....

    Intel Raises $15 Billion to Accelerate Chip Manufacturing
  • 2026 / 08 / 11

    Teledyne to Acquire Varex Imaging for $1.1 Billion

    Teledyne's $1.1 billion acquisition of Varex Imaging unites complementary X-ray technologies, strengthening its healthcare position....

    Teledyne to Acquire Varex Imaging for $1.1 Billion
  • 2026 / 08 / 10

    SK Hynix Invests 54 Trillion Won to Expand Yongin Y2 and Cheongju M17 Fabs

    SK Hynix commits 54 trillion won to build Yongin Y2 and Cheongju M17 fabs. The investment targets HBM and NAND to meet soaring AI demand....

    SK Hynix Invests 54 Trillion Won to Expand Yongin Y2 and Cheongju M17 Fabs
  • 2026 / 08 / 07

    TI TPSM Series Power Modules – Selection Guide

    TI TPSM modules integrate controller, MOSFETs, inductor, and passives in a single package. ust add caps – no loop design. Ideal for industrial, auto, telecom....

    TI TPSM Series Power Modules – Selection Guide
  • 2026 / 08 / 06

    All Three Major DRAM Manufacturers' 2027 Capacity Fully Sold Out

    Ccrisis intensifies: 2027 all DRAM/HBM capacity sold out by top 3 makers. AI GPU demand surges, NAND tightens through 2028....

    All Three Major DRAM Manufacturers' 2027 Capacity Fully Sold Out
  • 2026 / 08 / 05

    SK hynix And Sandisk Release HBF First Standard Specification

    SK hynix and SanDisk unveiled the first HBF standard via OCP, with up to 512GB and 3.0TB/s. This open spec bridges HBM and SSDs to tackle AI memory bottlenecks....

    SK hynix And Sandisk Release HBF First Standard Specification
Contact Information
close