AUIRS2112STRPBF
Introducing the AUIRS2112STRPBF, the ultimate solution for efficient and reliable automotive power management applications. Designed to meet the demands of the automotive industry, this high voltage IC integrates a gate driver and MOSFETs to deliver superior performance and maximize power efficiency. The AUIRS2112STRPBF is equipped with advanced features such as under-voltage lockout (UVLO), over-current protection, and over-temperature protection to ensure safe operation under all driving conditions. With a wide input voltage range of up to 600V, this IC is suitable for a variety of automotive applications including DC-DC converters, motor drives, and battery management systems. Featuring high peak output current, fast switching speeds, and low quiescent current consumption, the AUIRS2112STRPBF offers optimum power efficiency and reduced power loss. Its compact size and robust construction make it ideal for space-constrained automotive environments. Engineered with the highest quality standards, the AUIRS2112STRPBF guarantees long-lasting performance and reliability. Trust in the power and efficiency of the AUIRS2112STRPBF for exceptional automotive power management.
Other Products
View More-
onsemi LA2000-E
-
Texas Instruments DF1704E
-
onsemi LC823450XDTBG
-
Rohm Semiconductor BU64241GWZ-E2
-
Renesas Electronics America Inc R2S15900SP#D1
-
Analog Devices Inc./Maxim Integrated MAX4397DCTM+T
-
STMicroelectronics TDA7718B
-
Texas Instruments TAS5066PAGRG4
-
CML Microcircuits CMX7011L4
-
MACOM Technology Solutions M82708G-14
-
Texas Instruments TAS5026APAG
-
onsemi LC823450XCTBG
Related Blogs
-
2026 / 08 / 20
Marvell and Google Forge Strategic Partnership in Custom Product
Google diversifies its AI chip strategy via a custom semiconductor partnership with Marvell, spanning inference accelerators and networking silicon ...
-
2026 / 08 / 19
Supply Chain Cost Pressures Mount, ST Third Price Hike of 2026
ST issues third 2026 price hike, with product lines rising August 23. Barely four months since the last adjustment....
-
2026 / 08 / 18
Amkor Plans Spin-off of China Packaging and Testing Business
Amkor plans to spin off its China packaging unit, selling a majority stake valued at $1–1.5B. It Still in early stages....
-
2026 / 08 / 17
Accelerated Exit: Nokia to Close Hangzhou R&D Center
Nokia accelerates its China exit with the closure of its Hangzhou R&D center, cutting 1,600 jobs. ...
-
2026 / 08 / 13
IBM and Together AI Sign $240 Million Agreement
IBM and Together AI ink a $240M deal to deploy a NVIDIA Blackwell-powered open-source AI inference cluster on IBM Cloud....
-
2026 / 08 / 12
Intel Raises $15 Billion to Accelerate Chip Manufacturing
Intel raises $15B for AI silicon and manufacturing. It targets 18A/14A nodes, advanced packaging, and foundry growth....
-
2026 / 08 / 11
Teledyne to Acquire Varex Imaging for $1.1 Billion
Teledyne's $1.1 billion acquisition of Varex Imaging unites complementary X-ray technologies, strengthening its healthcare position....
-
2026 / 08 / 10
SK Hynix Invests 54 Trillion Won to Expand Yongin Y2 and Cheongju M17 Fabs
SK Hynix commits 54 trillion won to build Yongin Y2 and Cheongju M17 fabs. The investment targets HBM and NAND to meet soaring AI demand....
-
2026 / 08 / 07
TI TPSM Series Power Modules – Selection Guide
TI TPSM modules integrate controller, MOSFETs, inductor, and passives in a single package. ust add caps – no loop design. Ideal for industrial, auto, telecom....
-
2026 / 08 / 06
All Three Major DRAM Manufacturers' 2027 Capacity Fully Sold Out
Ccrisis intensifies: 2027 all DRAM/HBM capacity sold out by top 3 makers. AI GPU demand surges, NAND tightens through 2028....
