BAT54C KL3

Introducing the BAT54C KL3, the ultimate solution to your electronic circuitry needs. This small and versatile product is designed with precision to deliver exceptional performance and reliability in a wide range of applications. The BAT54C KL3 features a high forward current rating of up to 200 mA, making it perfect for use in small signal clipping and switching circuits. Its low reverse leakage current ensures minimal power dissipation and efficient operation, while its low forward voltage drop guarantees minimal voltage loss. This allows for efficient energy consumption and optimized circuit performance. Designed with a compact SOT-23 package, the BAT54C KL3 is easy to install and compatible with various PCB designs. Its high temperature soldering capability further enhances its versatility, making it suitable for use in demanding environments. Rest assured, the BAT54C KL3 is manufactured to the highest quality standards, ensuring excellent performance and long-lasting durability. Whether you are an electronics hobbyist or a professional engineer, the BAT54C KL3 is the perfect choice for your circuitry needs. Experience the power and reliability of the BAT54C KL3 today and take your electronic projects to the next level.

banner

Other Products

View More
  • Microchip Technology PIC16C56A-20/SO

    Microchip Technology PIC16C56A-20/SO

  • NXP USA Inc. S912XEQ512BCAA

    NXP USA Inc. S912XEQ512BCAA

  • Renesas Electronics America Inc R7F100GBH3CNP#AA0

    Renesas Electronics America Inc R7F100GBH3CNP#AA0

  • Infineon Technologies MB90F022CPF-GS-9022

    Infineon Technologies MB90F022CPF-GS-9022

  • NXP USA Inc. S912XEQ384F1MALR

    NXP USA Inc. S912XEQ384F1MALR

  • Infineon Technologies MB90F020CPMT-GS-9154

    Infineon Technologies MB90F020CPMT-GS-9154

  • NXP USA Inc. S912XEQ512J3MAGR

    NXP USA Inc. S912XEQ512J3MAGR

  • Infineon Technologies MB90F337PMC-G-SNE1

    Infineon Technologies MB90F337PMC-G-SNE1

  • Renesas Electronics America Inc R5F523E5SDFL#50

    Renesas Electronics America Inc R5F523E5SDFL#50

  • Renesas Electronics America Inc HD6417705F133V

    Renesas Electronics America Inc HD6417705F133V

  • Microchip Technology AT89LS52-16PI

    Microchip Technology AT89LS52-16PI

  • Infineon Technologies MB90F548GSPFR-G-ER

    Infineon Technologies MB90F548GSPFR-G-ER

Related Blogs

  • 2026 / 08 / 20

    Marvell and Google Forge Strategic Partnership in Custom Product

    Google diversifies its AI chip strategy via a custom semiconductor partnership with Marvell, spanning inference accelerators and networking silicon ...

    Marvell and Google Forge Strategic Partnership in Custom Product
  • 2026 / 08 / 19

    Supply Chain Cost Pressures Mount, ST Third Price Hike of 2026

    ST issues third 2026 price hike, with product lines rising August 23. Barely four months since the last adjustment....

    Supply Chain Cost Pressures Mount, ST Third Price Hike of 2026
  • 2026 / 08 / 18

    Amkor Plans Spin-off of China Packaging and Testing Business

    Amkor plans to spin off its China packaging unit, selling a majority stake valued at $1–1.5B. It Still in early stages....

    Amkor Plans Spin-off of China Packaging and Testing Business
  • 2026 / 08 / 17

    Accelerated Exit: Nokia to Close Hangzhou R&D Center

    Nokia accelerates its China exit with the closure of its Hangzhou R&D center, cutting 1,600 jobs. ...

    Accelerated Exit: Nokia to Close Hangzhou R&D Center
  • 2026 / 08 / 13

    IBM and Together AI Sign $240 Million Agreement

    IBM and Together AI ink a $240M deal to deploy a NVIDIA Blackwell-powered open-source AI inference cluster on IBM Cloud....

    IBM and Together AI Sign $240 Million Agreement
  • 2026 / 08 / 12

    Intel Raises $15 Billion to Accelerate Chip Manufacturing

    Intel raises $15B for AI silicon and manufacturing. It targets 18A/14A nodes, advanced packaging, and foundry growth....

    Intel Raises $15 Billion to Accelerate Chip Manufacturing
  • 2026 / 08 / 11

    Teledyne to Acquire Varex Imaging for $1.1 Billion

    Teledyne's $1.1 billion acquisition of Varex Imaging unites complementary X-ray technologies, strengthening its healthcare position....

    Teledyne to Acquire Varex Imaging for $1.1 Billion
  • 2026 / 08 / 10

    SK Hynix Invests 54 Trillion Won to Expand Yongin Y2 and Cheongju M17 Fabs

    SK Hynix commits 54 trillion won to build Yongin Y2 and Cheongju M17 fabs. The investment targets HBM and NAND to meet soaring AI demand....

    SK Hynix Invests 54 Trillion Won to Expand Yongin Y2 and Cheongju M17 Fabs
  • 2026 / 08 / 07

    TI TPSM Series Power Modules – Selection Guide

    TI TPSM modules integrate controller, MOSFETs, inductor, and passives in a single package. ust add caps – no loop design. Ideal for industrial, auto, telecom....

    TI TPSM Series Power Modules – Selection Guide
  • 2026 / 08 / 06

    All Three Major DRAM Manufacturers' 2027 Capacity Fully Sold Out

    Ccrisis intensifies: 2027 all DRAM/HBM capacity sold out by top 3 makers. AI GPU demand surges, NAND tightens through 2028....

    All Three Major DRAM Manufacturers' 2027 Capacity Fully Sold Out
Contact Information
close