EL7202CSZ

Introducing the EL7202CSZ – a cutting-edge solution for your electronic applications. The EL7202CSZ is a high-speed, dual-channel MOSFET driver designed to optimize performance and efficiency while providing superior control over your power electronics. With its robust design and advanced features, the EL7202CSZ offers unmatched versatility in a wide range of applications, such as motor control, power supplies, and electronic switches. Whether you need to drive high-power MOSFETs or IGBTs, this driver delivers precise and reliable performance, enabling your systems to operate at peak efficiency. Featuring a maximum output voltage of up to 19V and a peak output current of 4A, the EL7202CSZ ensures fast switching times and minimal power losses. Its integrated shoot-through protection and under-voltage lockout circuitry guarantee safe operation and protection for your power components. Furthermore, the EL7202CSZ incorporates thermal shutdown protection and a wide operating temperature range, making it suitable for demanding industrial environments. With its compact size and easy integration, this driver is an ideal choice for both new designs and retrofitting existing systems. Experience the power and efficiency of the EL7202CSZ – the ultimate MOSFET driver for your electronic applications.

banner

Other Products

View More
  • Skyworks Solutions Inc. SI3226-E-FQ

    Skyworks Solutions Inc. SI3226-E-FQ

  • Broadcom Limited BCM8747BKFBG

    Broadcom Limited BCM8747BKFBG

  • Analog Devices Inc./Maxim Integrated DS3134

    Analog Devices Inc./Maxim Integrated DS3134

  • Analog Devices Inc./Maxim Integrated DS21Q58L+

    Analog Devices Inc./Maxim Integrated DS21Q58L+

  • Texas Instruments UCC2750DW

    Texas Instruments UCC2750DW

  • Texas Instruments TCM9102N

    Texas Instruments TCM9102N

  • Microchip Technology VSC7432YIH

    Microchip Technology VSC7432YIH

  • MaxLinear, Inc. XRT73R06IB

    MaxLinear, Inc. XRT73R06IB

  • Infineon Technologies PEB4365TV1.1

    Infineon Technologies PEB4365TV1.1

  • Infineon Technologies CYV15G0402DXB-BGXC

    Infineon Technologies CYV15G0402DXB-BGXC

  • NXP Semiconductors M86291G12

    NXP Semiconductors M86291G12

  • Renesas Electronics America Inc 82P2910ABBG8

    Renesas Electronics America Inc 82P2910ABBG8

Related Blogs

  • 2026 / 08 / 20

    Marvell and Google Forge Strategic Partnership in Custom Product

    Google diversifies its AI chip strategy via a custom semiconductor partnership with Marvell, spanning inference accelerators and networking silicon ...

    Marvell and Google Forge Strategic Partnership in Custom Product
  • 2026 / 08 / 19

    Supply Chain Cost Pressures Mount, ST Third Price Hike of 2026

    ST issues third 2026 price hike, with product lines rising August 23. Barely four months since the last adjustment....

    Supply Chain Cost Pressures Mount, ST Third Price Hike of 2026
  • 2026 / 08 / 18

    Amkor Plans Spin-off of China Packaging and Testing Business

    Amkor plans to spin off its China packaging unit, selling a majority stake valued at $1–1.5B. It Still in early stages....

    Amkor Plans Spin-off of China Packaging and Testing Business
  • 2026 / 08 / 17

    Accelerated Exit: Nokia to Close Hangzhou R&D Center

    Nokia accelerates its China exit with the closure of its Hangzhou R&D center, cutting 1,600 jobs. ...

    Accelerated Exit: Nokia to Close Hangzhou R&D Center
  • 2026 / 08 / 13

    IBM and Together AI Sign $240 Million Agreement

    IBM and Together AI ink a $240M deal to deploy a NVIDIA Blackwell-powered open-source AI inference cluster on IBM Cloud....

    IBM and Together AI Sign $240 Million Agreement
  • 2026 / 08 / 12

    Intel Raises $15 Billion to Accelerate Chip Manufacturing

    Intel raises $15B for AI silicon and manufacturing. It targets 18A/14A nodes, advanced packaging, and foundry growth....

    Intel Raises $15 Billion to Accelerate Chip Manufacturing
  • 2026 / 08 / 11

    Teledyne to Acquire Varex Imaging for $1.1 Billion

    Teledyne's $1.1 billion acquisition of Varex Imaging unites complementary X-ray technologies, strengthening its healthcare position....

    Teledyne to Acquire Varex Imaging for $1.1 Billion
  • 2026 / 08 / 10

    SK Hynix Invests 54 Trillion Won to Expand Yongin Y2 and Cheongju M17 Fabs

    SK Hynix commits 54 trillion won to build Yongin Y2 and Cheongju M17 fabs. The investment targets HBM and NAND to meet soaring AI demand....

    SK Hynix Invests 54 Trillion Won to Expand Yongin Y2 and Cheongju M17 Fabs
  • 2026 / 08 / 07

    TI TPSM Series Power Modules – Selection Guide

    TI TPSM modules integrate controller, MOSFETs, inductor, and passives in a single package. ust add caps – no loop design. Ideal for industrial, auto, telecom....

    TI TPSM Series Power Modules – Selection Guide
  • 2026 / 08 / 06

    All Three Major DRAM Manufacturers' 2027 Capacity Fully Sold Out

    Ccrisis intensifies: 2027 all DRAM/HBM capacity sold out by top 3 makers. AI GPU demand surges, NAND tightens through 2028....

    All Three Major DRAM Manufacturers' 2027 Capacity Fully Sold Out
Contact Information
close