EPF10K30RC240-4N

The EPF10K30RC240-4N is a highly advanced and efficient programmable logic device designed to meet the ever-growing demands of today's technology-driven world. With its cutting-edge features and superior performance, this product is ideal for a wide range of applications including telecommunications, automotive, industrial automation, and more. Featuring a high-density architecture with a capacity of up to 240K system gates, the EPF10K30RC240-4N offers ample space for complex designs while ensuring maximum flexibility and scalability. With a robust set of advanced features such as user flash memory, high-speed I/Os, and on-chip peripherals, this product enables designers to create highly optimized solutions that deliver exceptional performance and efficiency. In addition, the EPF10K30RC240-4N comes with a comprehensive suite of design tools and resources that facilitate quick and seamless development. This includes a user-friendly graphical interface, extensive libraries, and a rich set of debugging capabilities, allowing engineers to streamline their design process and accelerate time to market. With its unparalleled performance, versatility, and design support, the EPF10K30RC240-4N is the perfect choice for designers seeking to push the boundaries of innovation and deliver cutting-edge solutions to their customers.

banner

Other Products

View More
  • 2368-505-0006-ND

    2368-505-0006-ND

  • 2368-505-0004-ND

    2368-505-0004-ND

  • SP018-1-11-ND

    SP018-1-11-ND

  • E15-1-11-ND

    E15-1-11-ND

  • 987-1653-ND

    987-1653-ND

  • 693-21A21B10-ND

    693-21A21B10-ND

  • SP015-1-11-ND

    SP015-1-11-ND

  • SP021P-1-11-ND

    SP021P-1-11-ND

  • 2641-ND

    2641-ND

  • 2368-503-0006-ND

    2368-503-0006-ND

  • 716-25A11B10-ND

    716-25A11B10-ND

  • H-22-6A-B-ND

    H-22-6A-B-ND

Related Blogs

  • 2025 / 12 / 01

    HP Announces Global Layoffs of Up to 6,000 Employees: Strategic Shift Amid AI Transition

    HP announced plans to cut 4,000 to 6,000 jobs globally by 2028 as part of a three-year reform to enhance efficiency and innovation through AI. ...

    HP Announces Global Layoffs of Up to 6,000 Employees: Strategic Shift Amid AI Transition
  • 2025 / 11 / 28

    Top IC Chips: A Detailed Analysis of the Popular Chip Solutions

    A detailed analysis of six popular IC chips, including clock fanout buffers, EEPROM memory, linear voltage regulators, ADCs, shift registers, and voltage level translators. ...

    Top IC Chips: A Detailed Analysis of the Popular Chip Solutions
  • 2025 / 11 / 27

    Onsemi Announces $6 Billion Stock Repurchase Authorization Plan

    Onsemi announces a $6 billion stock repurchase plan effective from January 1, 2026, to December 31, 2028, replacing the previous $3 billion authorization....

    Onsemi Announces $6 Billion Stock Repurchase Authorization Plan
  • 2025 / 11 / 26

    Unlocking Potential: A Deep Dive into Diodes Incorporated

    Diodes Incorporated is a global leader in semiconductor manufacturing, specializing in discrete, analog, and mixed-signal products for diverse markets including automotive, industrial, and consumer electronics....

    Unlocking Potential: A Deep Dive into Diodes Incorporated
  • 2025 / 11 / 25

    Google's Chip Sales: A New Competitive Landscape in the AI Chip Market

    Google is expanding its chip business by selling Tensor AI chips directly to customers like Meta Platforms. This move intensifies competition in the AI chip market, challenging Nvidia and AMD. ...

    Google's Chip Sales: A New Competitive Landscape in the AI Chip Market
  • 2025 / 11 / 24

    Foxconn and OpenAI Collaboration: Producing Key AI Components in the U.S.

    Foxconn and OpenAI are collaborating to design and manufacture key AI components in the U.S., leveraging OpenAI's technical insights and Foxconn's manufacturing expertise. ...

    Foxconn and OpenAI Collaboration: Producing Key AI Components in the U.S.
  • 2025 / 11 / 21

    HBM Giants Reconcile: Hanmi Semiconductor and SK Hynix Reach New Collaboration

    Hanmi Semiconductor and SK Hynix have reconciled, signing a 1.5 billion KRW contract for HBM manufacturing equipment. This marks a significant repair in their relationship after SK Hynix's shift to a multi-supplier strategy in 2024....

    HBM Giants Reconcile: Hanmi Semiconductor and SK Hynix Reach New Collaboration
  • 2025 / 11 / 20

    Samsung's Memory Strategy: Focus on DRAM Profitability, Suspend HBM Expansion

    Samsung is adjusting its memory business strategy to focus on expanding DRAM production amid rising market prices, aiming to boost profitability....

    Samsung's Memory Strategy: Focus on DRAM Profitability, Suspend HBM Expansion
  • 2025 / 11 / 19

    ST Delivers the World's First 18nm MCU: STM32V8 Microcontroller

    ST launched the world's first 18nm MCU, STM32V8, designed for demanding industrial applications. Manufactured in ST's Crolles fab and in collaboration with Samsung Foundry, it is expected to be officially supplied in Q1 2026....

    ST Delivers the World's First 18nm MCU: STM32V8 Microcontroller
  • 2025 / 11 / 18

    $165 billion Investment in US Chips: TSMC Faces Challenges in Recouping Costs

    Under US government pressure, TSMC has invested $165 billion to build advanced chip factories in Arizona, facing challenges in recouping costs. ...

    $165 billion Investment in US Chips: TSMC Faces Challenges in Recouping Costs
Contact Information
close