AD8032ANZ

The AD8032ANZ is a dual high-speed voltage feedback amplifier that offers excellent performance and versatility for a wide range of applications. With a bandwidth of 280 MHz, this amplifier is capable of handling high-frequency signals with ease, making it ideal for use in communication systems, medical equipment, and test and measurement applications. The AD8032ANZ features a low distortion level of -84 dBc at 10 MHz, ensuring clear and accurate signal reproduction. It also offers a high slew rate of 2400 V/μs, enabling fast signal transitions without distortion. This amplifier operates from a single power supply voltage of 5V to 12V, making it convenient for a variety of systems. Its low power consumption of only 6.5 mA per amplifier also contributes to energy efficiency. The AD8032ANZ comes in a compact 8-lead PDIP package, allowing for easy integration into PCB designs. It has a wide operating temperature range of -40°C to +85°C, ensuring reliable performance in harsh environments. With its superior performance, versatility, and compact design, the AD8032ANZ is the perfect choice for demanding applications that require high-speed amplification.

banner

Other Products

View More
  • Analog Devices Inc./Maxim Integrated MAX4524ETB+

    Analog Devices Inc./Maxim Integrated MAX4524ETB+

  • Texas Instruments SN74LV4052APWT

    Texas Instruments SN74LV4052APWT

  • Analog Devices Inc./Maxim Integrated MAX4580EPE

    Analog Devices Inc./Maxim Integrated MAX4580EPE

  • Analog Devices Inc./Maxim Integrated MAX352ESE+T

    Analog Devices Inc./Maxim Integrated MAX352ESE+T

  • Analog Devices Inc./Maxim Integrated MAX4542ESA

    Analog Devices Inc./Maxim Integrated MAX4542ESA

  • Texas Instruments TMUX1104DQAR

    Texas Instruments TMUX1104DQAR

  • Analog Devices Inc./Maxim Integrated MAX4581ESE+

    Analog Devices Inc./Maxim Integrated MAX4581ESE+

  • Analog Devices Inc. ADG1433YRUZ-REEL7

    Analog Devices Inc. ADG1433YRUZ-REEL7

  • Analog Devices Inc./Maxim Integrated MAX4700EPE

    Analog Devices Inc./Maxim Integrated MAX4700EPE

  • Analog Devices Inc./Maxim Integrated MAX4666CPE

    Analog Devices Inc./Maxim Integrated MAX4666CPE

  • Analog Devices Inc./Maxim Integrated MAX317EPA+

    Analog Devices Inc./Maxim Integrated MAX317EPA+

  • Analog Devices Inc./Maxim Integrated MAX308EPE

    Analog Devices Inc./Maxim Integrated MAX308EPE

Related Blogs

  • 2026 / 08 / 19

    Supply Chain Cost Pressures Mount, ST Third Price Hike of 2026

    ST issues third 2026 price hike, with product lines rising August 23. Barely four months since the last adjustment....

    Supply Chain Cost Pressures Mount, ST Third Price Hike of 2026
  • 2026 / 08 / 18

    Amkor Plans Spin-off of China Packaging and Testing Business

    Amkor plans to spin off its China packaging unit, selling a majority stake valued at $1–1.5B. It Still in early stages....

    Amkor Plans Spin-off of China Packaging and Testing Business
  • 2026 / 08 / 17

    Accelerated Exit: Nokia to Close Hangzhou R&D Center

    Nokia accelerates its China exit with the closure of its Hangzhou R&D center, cutting 1,600 jobs. ...

    Accelerated Exit: Nokia to Close Hangzhou R&D Center
  • 2026 / 08 / 13

    IBM and Together AI Sign $240 Million Agreement

    IBM and Together AI ink a $240M deal to deploy a NVIDIA Blackwell-powered open-source AI inference cluster on IBM Cloud....

    IBM and Together AI Sign $240 Million Agreement
  • 2026 / 08 / 12

    Intel Raises $15 Billion to Accelerate Chip Manufacturing

    Intel raises $15B for AI silicon and manufacturing. It targets 18A/14A nodes, advanced packaging, and foundry growth....

    Intel Raises $15 Billion to Accelerate Chip Manufacturing
  • 2026 / 08 / 11

    Teledyne to Acquire Varex Imaging for $1.1 Billion

    Teledyne's $1.1 billion acquisition of Varex Imaging unites complementary X-ray technologies, strengthening its healthcare position....

    Teledyne to Acquire Varex Imaging for $1.1 Billion
  • 2026 / 08 / 10

    SK Hynix Invests 54 Trillion Won to Expand Yongin Y2 and Cheongju M17 Fabs

    SK Hynix commits 54 trillion won to build Yongin Y2 and Cheongju M17 fabs. The investment targets HBM and NAND to meet soaring AI demand....

    SK Hynix Invests 54 Trillion Won to Expand Yongin Y2 and Cheongju M17 Fabs
  • 2026 / 08 / 07

    TI TPSM Series Power Modules – Selection Guide

    TI TPSM modules integrate controller, MOSFETs, inductor, and passives in a single package. ust add caps – no loop design. Ideal for industrial, auto, telecom....

    TI TPSM Series Power Modules – Selection Guide
  • 2026 / 08 / 06

    All Three Major DRAM Manufacturers' 2027 Capacity Fully Sold Out

    Ccrisis intensifies: 2027 all DRAM/HBM capacity sold out by top 3 makers. AI GPU demand surges, NAND tightens through 2028....

    All Three Major DRAM Manufacturers' 2027 Capacity Fully Sold Out
  • 2026 / 08 / 05

    SK hynix And Sandisk Release HBF First Standard Specification

    SK hynix and SanDisk unveiled the first HBF standard via OCP, with up to 512GB and 3.0TB/s. This open spec bridges HBM and SSDs to tackle AI memory bottlenecks....

    SK hynix And Sandisk Release HBF First Standard Specification
Contact Information
close