EPF10K50VRC240-3N

Introducing the EPF10K50VRC240-3N, a powerful and versatile programmable logic device designed to meet the needs of today's most demanding applications. Featuring a robust architecture and an impressive array of features, this product delivers high-performance and flexibility for a wide range of design challenges. With a whopping 50,000 logic elements, it offers ample resources to tackle complex designs while maintaining optimum speed and efficiency. Thanks to the 3.3-volt technology, the EPF10K50VRC240-3N offers low power consumption without compromising on performance. Its advanced architecture allows for easy programming and reprogramming, making it an ideal choice for rapid prototyping and development. Equipped with 240 pins and supporting a wide range of I/O standards, this programmable logic device provides seamless integration with other components, ensuring compatibility and easy connectivity. Whether you're designing cutting-edge industrial applications, telecommunications systems, or high-end consumer products, the EPF10K50VRC240-3N is the perfect solution to meet your requirements. Its superior performance, power efficiency, and flexibility make it the go-to choice for engineers and designers seeking a reliable and versatile programmable logic device.

banner

Other Products

View More
  • Motorola 54121/BCBJC

    Motorola 54121/BCBJC

  • NXP USA Inc. HEF4938BT,112

    NXP USA Inc. HEF4938BT,112

  • Texas Instruments CD54HC4538F

    Texas Instruments CD54HC4538F

  • onsemi MC14538BFELG

    onsemi MC14538BFELG

  • onsemi 74VHC221AM

    onsemi 74VHC221AM

  • onsemi NLV14538BDR2G

    onsemi NLV14538BDR2G

  • Analog Devices Inc. LTC6993IS6-3#TRPBF

    Analog Devices Inc. LTC6993IS6-3#TRPBF

  • Analog Devices Inc. LTC6993HS6-1#TR

    Analog Devices Inc. LTC6993HS6-1#TR

  • Nexperia USA Inc. 74LV123PW,118

    Nexperia USA Inc. 74LV123PW,118

  • Texas Instruments CD4047BEE4

    Texas Instruments CD4047BEE4

  • NXP USA Inc. 74LV123N,112

    NXP USA Inc. 74LV123N,112

  • NXP USA Inc. 74HC123D/AU118

    NXP USA Inc. 74HC123D/AU118

Related Blogs

  • 2026 / 05 / 15

    Tower Semiconductor Secures $1.3 Billion Silicon Photonics Order

    Tower Semiconductor lands $1.3B silicon photonics deal for 2027, locking AI data center demand. Scaling CPO & optical interconnect capacity....

    Tower Semiconductor Secures $1.3 Billion Silicon Photonics Order
  • 2026 / 05 / 14

    New Products from ST: High-Precision Op Amp and Ultra-Low-Power Image Sensors

    ST launches TSB192 precision dual op-amp with 20µV offset and 8MHz bandwidth, alongside VD55G4/VD65G4 ultra-low-power global-shutter image sensors in the BrightSense family....

    New Products from ST: High-Precision Op Amp and Ultra-Low-Power Image Sensors
  • 2026 / 05 / 13

    Cmsemicon Advances Memory Portfolio: CMS25Q32A Mass Production Imminent

    Cmsemicon CMS25Q32A 32 Mbit SPI NOR Flash completes mass-production qualification, expanding its MCU-plus memory lineup for embedded, IoT and smart hardware....

    Cmsemicon Advances Memory Portfolio: CMS25Q32A Mass Production Imminent
  • 2026 / 05 / 12

    Analysis and Selection Guide for Popular Electronic Components in May

    Driven by AI, EVs, and automation, demand surges for core components like MCUs, memory, PMICs, and RF chips in May 2026. This guide analyzes popular parts for selection....

    Analysis and Selection Guide for Popular Electronic Components in May
  • 2026 / 05 / 11

    Selection Guide: In-Depth Analysis of Voltage Reference ICs

    Voltage Reference ICs deliver ultra-stable, precision voltage outputs essential for ADC/DAC accuracy. Key specs include initial accuracy, temperature coefficient, and low-frequency noise. ...

    Selection Guide: In-Depth Analysis of Voltage Reference ICs
  • 2026 / 05 / 09

    Google Tensor G7 Chip: Continues with 2nm Process

    Google's upcoming Tensor G7 chip, manufactured by TSMC on a 2nm process, is set to power the Pixel 12 series. It continues Google's AI-first design philosophy......

    Google Tensor G7 Chip: Continues with 2nm Process
  • 2026 / 05 / 08

    Industry Restructuring: ICE Automakers Divest Non-Core Manufacturing Assets

    Global ICE automakers are divesting non-core manufacturing assets, while Chinese EV makers capitalize by acquiring idle overseas capacity to accelerate expansion....

    Industry Restructuring: ICE Automakers Divest Non-Core Manufacturing Assets
  • 2026 / 05 / 07

    Samsung Completely Exits the Chinese Home Appliance Market

    Samsung exits China's home appliance market effective May 6, 2026, halting sales of TVs, refrigerators, and more, while keeping its smartphone business. ...

    Samsung Completely Exits the Chinese Home Appliance Market
  • 2026 / 05 / 04

    Modern Electronics Core: A Guide to CMOS Logic Gate ICs

    CMOS logic gate ICs form the foundation of digital circuits. They use complementary MOSFET pairs for near-zero static power, high noise immunity, and versatile voltage operation....

    Modern Electronics Core: A Guide to CMOS Logic Gate ICs
  • 2026 / 04 / 30

    Amazon Rises to Top Three in Global Data Center Chip Market

    Amazon has become a top-three data center chip designer, with its in-house semiconductor business now generating over $20B annually....

    Amazon Rises to Top Three in Global Data Center Chip Market
Contact Information
close