EPF10K50VRC240-3N

Introducing the EPF10K50VRC240-3N, a powerful and versatile programmable logic device designed to meet the needs of today's most demanding applications. Featuring a robust architecture and an impressive array of features, this product delivers high-performance and flexibility for a wide range of design challenges. With a whopping 50,000 logic elements, it offers ample resources to tackle complex designs while maintaining optimum speed and efficiency. Thanks to the 3.3-volt technology, the EPF10K50VRC240-3N offers low power consumption without compromising on performance. Its advanced architecture allows for easy programming and reprogramming, making it an ideal choice for rapid prototyping and development. Equipped with 240 pins and supporting a wide range of I/O standards, this programmable logic device provides seamless integration with other components, ensuring compatibility and easy connectivity. Whether you're designing cutting-edge industrial applications, telecommunications systems, or high-end consumer products, the EPF10K50VRC240-3N is the perfect solution to meet your requirements. Its superior performance, power efficiency, and flexibility make it the go-to choice for engineers and designers seeking a reliable and versatile programmable logic device.

banner

Other Products

View More
  • Motorola 54121/BCBJC

    Motorola 54121/BCBJC

  • NXP USA Inc. HEF4938BT,112

    NXP USA Inc. HEF4938BT,112

  • Texas Instruments CD54HC4538F

    Texas Instruments CD54HC4538F

  • onsemi MC14538BFELG

    onsemi MC14538BFELG

  • onsemi 74VHC221AM

    onsemi 74VHC221AM

  • onsemi NLV14538BDR2G

    onsemi NLV14538BDR2G

  • Analog Devices Inc. LTC6993IS6-3#TRPBF

    Analog Devices Inc. LTC6993IS6-3#TRPBF

  • Analog Devices Inc. LTC6993HS6-1#TR

    Analog Devices Inc. LTC6993HS6-1#TR

  • Nexperia USA Inc. 74LV123PW,118

    Nexperia USA Inc. 74LV123PW,118

  • Texas Instruments CD4047BEE4

    Texas Instruments CD4047BEE4

  • NXP USA Inc. 74LV123N,112

    NXP USA Inc. 74LV123N,112

  • NXP USA Inc. 74HC123D/AU118

    NXP USA Inc. 74HC123D/AU118

Related Blogs

  • 2026 / 08 / 20

    Marvell and Google Forge Strategic Partnership in Custom Product

    Google diversifies its AI chip strategy via a custom semiconductor partnership with Marvell, spanning inference accelerators and networking silicon ...

    Marvell and Google Forge Strategic Partnership in Custom Product
  • 2026 / 08 / 19

    Supply Chain Cost Pressures Mount, ST Third Price Hike of 2026

    ST issues third 2026 price hike, with product lines rising August 23. Barely four months since the last adjustment....

    Supply Chain Cost Pressures Mount, ST Third Price Hike of 2026
  • 2026 / 08 / 18

    Amkor Plans Spin-off of China Packaging and Testing Business

    Amkor plans to spin off its China packaging unit, selling a majority stake valued at $1–1.5B. It Still in early stages....

    Amkor Plans Spin-off of China Packaging and Testing Business
  • 2026 / 08 / 17

    Accelerated Exit: Nokia to Close Hangzhou R&D Center

    Nokia accelerates its China exit with the closure of its Hangzhou R&D center, cutting 1,600 jobs. ...

    Accelerated Exit: Nokia to Close Hangzhou R&D Center
  • 2026 / 08 / 13

    IBM and Together AI Sign $240 Million Agreement

    IBM and Together AI ink a $240M deal to deploy a NVIDIA Blackwell-powered open-source AI inference cluster on IBM Cloud....

    IBM and Together AI Sign $240 Million Agreement
  • 2026 / 08 / 12

    Intel Raises $15 Billion to Accelerate Chip Manufacturing

    Intel raises $15B for AI silicon and manufacturing. It targets 18A/14A nodes, advanced packaging, and foundry growth....

    Intel Raises $15 Billion to Accelerate Chip Manufacturing
  • 2026 / 08 / 11

    Teledyne to Acquire Varex Imaging for $1.1 Billion

    Teledyne's $1.1 billion acquisition of Varex Imaging unites complementary X-ray technologies, strengthening its healthcare position....

    Teledyne to Acquire Varex Imaging for $1.1 Billion
  • 2026 / 08 / 10

    SK Hynix Invests 54 Trillion Won to Expand Yongin Y2 and Cheongju M17 Fabs

    SK Hynix commits 54 trillion won to build Yongin Y2 and Cheongju M17 fabs. The investment targets HBM and NAND to meet soaring AI demand....

    SK Hynix Invests 54 Trillion Won to Expand Yongin Y2 and Cheongju M17 Fabs
  • 2026 / 08 / 07

    TI TPSM Series Power Modules – Selection Guide

    TI TPSM modules integrate controller, MOSFETs, inductor, and passives in a single package. ust add caps – no loop design. Ideal for industrial, auto, telecom....

    TI TPSM Series Power Modules – Selection Guide
  • 2026 / 08 / 06

    All Three Major DRAM Manufacturers' 2027 Capacity Fully Sold Out

    Ccrisis intensifies: 2027 all DRAM/HBM capacity sold out by top 3 makers. AI GPU demand surges, NAND tightens through 2028....

    All Three Major DRAM Manufacturers' 2027 Capacity Fully Sold Out
Contact Information
close